Particles as transport carriers in CMP slurries

Daniela White*, John Parker, Shuyou Li, Vinayak Dravid

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations


Nanoparticles provide multiple functionalities (chemical, mechanical) to the performance of CMP slurries. In this presentation we will highlight the significance of slurry abrasives as surface modified nanoparticles/chemical carriers, able to directly participate and control the metal oxidation/removal mechanism, removal rates and other polishing characteristics. We will discuss two relevant examples, both involving fumed silica as the carrier particle in two different low pH slurries of variable complexities in terms of design (with/without particles surface modifiers) and performance requirements for tungsten CMP. We will provide a complex variety of analytical evidence (TEMEELS, SEM, FT-IR, GPC, cyclic voltammetry, MS-TOF) in order to support the proposed mechanism of "chemically activated fumed silica", in its natural (no interactions with organic additives in the slurry) and surface modified form (in-situ interactions with organic additives), as a carrier of selective slurry components with enhanced chemical activity, that ultimately controls the tungsten CMP mechanism and the ability of the slurry to efficiently and predictably remove the oxidized tungsten film formed at the wafer surface.

Original languageEnglish (US)
Title of host publication2007 MRS Spring Meeting
Number of pages6
StatePublished - Dec 1 2007
Event2007 MRS Spring Meeting - San Francisco, CA, United States
Duration: Apr 10 2007Apr 12 2007

Publication series

NameMaterials Research Society Symposium Proceedings
ISSN (Print)0272-9172


Other2007 MRS Spring Meeting
Country/TerritoryUnited States
CitySan Francisco, CA

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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