Patterned Self-Assembled Monolayers Formed by Microcontact Printing Direct Selective Metalization by Chemical Vapor Deposition on Planar and Nonplanar Substrates

Noo Li Jeon; Ralph G. Nuzzo; Younan Xia; Milan Mrksich; George M. Whitesides

doi:10.1021/la00008a029

Patterned Self-Assembled Monolayers Formed by Microcontact Printing Direct Selective Metalization by Chemical Vapor Deposition on Planar and Nonplanar Substrates

Noo Li Jeon, Ralph G. Nuzzo, Younan Xia, Milan Mrksich, George M. Whitesides

Biomedical Engineering

Research output: Contribution to journal › Article › peer-review

169 Scopus citations

Abstract

Self-assembled monolayers (SAMs) of alkylsiloxanes were patterned by microcontact printing (μCP) on a number of substrates: Al/Al₂O₃, Si/SiO₂, TiN/TiO₂, glasses, indium tin oxide (ITO), and plasma-modified polyimide. The patterned SAMs on these surfaces define and direct the selective chemical vapor deposition (CVD) of copper using (hexafluoroacetylacetonato)(vinyltrimethylsilane)copper(I) (Cu^I(hfac)(vtms)) as the source gas. This paper presents several examples of microstructures of copper fabricated by selective, SAM-directed CVD, including fabrication of thin-film interconnects (with feature sizes of 0.5–100 μm), and selective filling of trenches and vias (models of microstructures having high aspect ratios) with feature sizes below 1 μm.

Original language	English (US)
Pages (from-to)	3024-3026
Number of pages	3
Journal	Langmuir
Volume	11
Issue number	8
DOIs	https://doi.org/10.1021/la00008a029
State	Published - Aug 1 1995

ASJC Scopus subject areas

General Materials Science
Condensed Matter Physics
Surfaces and Interfaces
Spectroscopy
Electrochemistry

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title = "Patterned Self-Assembled Monolayers Formed by Microcontact Printing Direct Selective Metalization by Chemical Vapor Deposition on Planar and Nonplanar Substrates",

abstract = "Self-assembled monolayers (SAMs) of alkylsiloxanes were patterned by microcontact printing (μCP) on a number of substrates: Al/Al2O3, Si/SiO2, TiN/TiO2, glasses, indium tin oxide (ITO), and plasma-modified polyimide. The patterned SAMs on these surfaces define and direct the selective chemical vapor deposition (CVD) of copper using (hexafluoroacetylacetonato)(vinyltrimethylsilane)copper(I) (CuI(hfac)(vtms)) as the source gas. This paper presents several examples of microstructures of copper fabricated by selective, SAM-directed CVD, including fabrication of thin-film interconnects (with feature sizes of 0.5–100 μm), and selective filling of trenches and vias (models of microstructures having high aspect ratios) with feature sizes below 1 μm.",

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AU - Jeon, Noo Li

AU - Nuzzo, Ralph G.

AU - Xia, Younan

AU - Mrksich, Milan

AU - Whitesides, George M.

PY - 1995/8/1

Y1 - 1995/8/1

N2 - Self-assembled monolayers (SAMs) of alkylsiloxanes were patterned by microcontact printing (μCP) on a number of substrates: Al/Al2O3, Si/SiO2, TiN/TiO2, glasses, indium tin oxide (ITO), and plasma-modified polyimide. The patterned SAMs on these surfaces define and direct the selective chemical vapor deposition (CVD) of copper using (hexafluoroacetylacetonato)(vinyltrimethylsilane)copper(I) (CuI(hfac)(vtms)) as the source gas. This paper presents several examples of microstructures of copper fabricated by selective, SAM-directed CVD, including fabrication of thin-film interconnects (with feature sizes of 0.5–100 μm), and selective filling of trenches and vias (models of microstructures having high aspect ratios) with feature sizes below 1 μm.

AB - Self-assembled monolayers (SAMs) of alkylsiloxanes were patterned by microcontact printing (μCP) on a number of substrates: Al/Al2O3, Si/SiO2, TiN/TiO2, glasses, indium tin oxide (ITO), and plasma-modified polyimide. The patterned SAMs on these surfaces define and direct the selective chemical vapor deposition (CVD) of copper using (hexafluoroacetylacetonato)(vinyltrimethylsilane)copper(I) (CuI(hfac)(vtms)) as the source gas. This paper presents several examples of microstructures of copper fabricated by selective, SAM-directed CVD, including fabrication of thin-film interconnects (with feature sizes of 0.5–100 μm), and selective filling of trenches and vias (models of microstructures having high aspect ratios) with feature sizes below 1 μm.

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Patterned Self-Assembled Monolayers Formed by Microcontact Printing Direct Selective Metalization by Chemical Vapor Deposition on Planar and Nonplanar Substrates

Abstract

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