Abstract
A new process for plasma oxidation of GaAs has been developed. Oxide films formed by this simple one-step dry process have amorphous structure, with composition and thickness uniformity better than ±10% over areas ≲1 cm2. They have a gallium-to-arsenic ratio of nearly one. The electrical properties (I-V, C-V) of the films are such that this process may be useful in device fabrication.
Original language | English (US) |
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Pages (from-to) | 56-58 |
Number of pages | 3 |
Journal | Applied Physics Letters |
Volume | 29 |
Issue number | 1 |
DOIs | |
State | Published - 1976 |
ASJC Scopus subject areas
- Physics and Astronomy (miscellaneous)