PLASMA OXIDATION OF SEMICONDUCTOR AND METAL SURFACES.

R. P H Chang*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Plasma oxidation is a process whereby surfaces are oxidized in an oxygen gas discharge via active neutral and charged oxygen species. In recent years it has attracted much interest in the microelectronics industry where low temperature, dry processes are widely used for fabricating VLSI devices. For example, oxides can be used for surface passivation, device isolation, charge storage, optical wave guides, and diffusion inhibition, to mention just a few. A brief overview of the current understanding of plasma oxidation of Si, compound semiconductors, and metals is presented. Using analytical instrumentations such as ion, electron, and photon spectroscopy much information have been gathered on the oxide films and their interfacial properties. Discussions on oxidation mechanisms pertaining to plasma-surface interaction, bulk oxygen species transport, and oxide-substrate interfacial reactions are given with illustrations from different oxide systems. In the area of practical applications, examples are given to show how plasma oxides can be used in micro-electronic device fabrication. (Edited author abstract. )

Original languageEnglish (US)
Title of host publicationThin Films Science and Technology
PublisherElsevier
Pages437-444
Number of pages8
ISBN (Print)0444422528, 9780444422521
DOIs
StatePublished - Jan 1 1983

Publication series

NameThin Films Science and Technology
ISSN (Print)0168-2075

ASJC Scopus subject areas

  • General Engineering

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