Power density minimization for highly-associative caches in embedded processors

Ja Chun Ku*, Serkan Ozdemir, Gokhan Memik, Yehea Ismail

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Caches are essential components in embedded processors, taking up a significant fraction of the chip area and power. As a result of the relatively large size and infrequent activity, leakage power of caches is becoming an important problem. There exist a number of power density minimization schemes that distribute the activity evenly among computational entities, thereby lowering the temperature to reduce the leakage power. In this paper, we first present various power density minimization schemes for highly-associative caches in embedded processors via access distribution. It is then suggested that they should be used in conjunction with other power-down techniques to be more effective. We show that conventional power-down techniques for on-chip caches can be suboptimal if thermal effects are ignored, and propose a thermal-aware power-down technique that minimizes power density of the active parts. Simulations based on MediaBench, NetBench, and MiBench applications in a 70nm technology show that the proposed thermal-aware schemes can improve leakage power savings of a conventional power-down technique by 8.5% on average, and up to 23%.

Original languageEnglish (US)
Title of host publicationGLSVLSI'06 - Proceedings of the 2006 ACM Great Lakes Symposium on VLSI
Pages100-104
Number of pages5
StatePublished - Nov 16 2006
EventGLSVLSI'06 - 2006 ACM Great Lakes Symposium on VLSI - Philadelphia, PA, United States
Duration: Apr 30 2006May 2 2006

Publication series

NameProceedings of the ACM Great Lakes Symposium on VLSI, GLSVLSI
Volume2006

Other

OtherGLSVLSI'06 - 2006 ACM Great Lakes Symposium on VLSI
Country/TerritoryUnited States
CityPhiladelphia, PA
Period4/30/065/2/06

Keywords

  • Cache
  • Embedded processor
  • Leakage power
  • Temperature

ASJC Scopus subject areas

  • Engineering(all)

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