Power, thermal, and reliability modeling in nanometer-scale microprocessors

David Brooks; Robert P. Dick; Russell E Joseph; Li Shang

doi:10.1109/MM.2007.58

Power, thermal, and reliability modeling in nanometer-scale microprocessors

David Brooks, Robert P. Dick, Russell E Joseph, Li Shang

Electrical and Computer Engineering

Research output: Contribution to journal › Article › peer-review

109 Scopus citations

Abstract

Power is the source of the greatest problems facing microprocessor designers. Rapid power variation brings transient errors. High power densities bring high temperatures, harming reliability and increasing leakage power. The wages of power are bulky, short-lived batteries, huge heat sinks, large on-die capacitors, high server electric bills, and unreliable microprocessors. Optimizing power depends on accurate and efficient modeling that spans different disciplines and levels, from device physics, to numerical methods, to microarchitectural design.

Original language	English (US)
Pages (from-to)	49-62
Number of pages	14
Journal	IEEE Micro
Volume	27
Issue number	3
DOIs	https://doi.org/10.1109/MM.2007.58
State	Published - May 2007

Keywords

Modeling of computer architecture
Power models
Process variation
Reliability models
Thermal analysis

ASJC Scopus subject areas

Software
Hardware and Architecture
Electrical and Electronic Engineering

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10.1109/MM.2007.58

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title = "Power, thermal, and reliability modeling in nanometer-scale microprocessors",

abstract = "Power is the source of the greatest problems facing microprocessor designers. Rapid power variation brings transient errors. High power densities bring high temperatures, harming reliability and increasing leakage power. The wages of power are bulky, short-lived batteries, huge heat sinks, large on-die capacitors, high server electric bills, and unreliable microprocessors. Optimizing power depends on accurate and efficient modeling that spans different disciplines and levels, from device physics, to numerical methods, to microarchitectural design.",

keywords = "Modeling of computer architecture, Power models, Process variation, Reliability models, Thermal analysis",

author = "David Brooks and Dick, {Robert P.} and Joseph, {Russell E} and Li Shang",

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Power, thermal, and reliability modeling in nanometer-scale microprocessors

Abstract

Keywords

ASJC Scopus subject areas

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