Power, thermal, and reliability modeling in nanometer-scale microprocessors

David Brooks, Robert P. Dick, Russell E Joseph, Li Shang

Research output: Contribution to journalArticlepeer-review

99 Scopus citations

Abstract

Power is the source of the greatest problems facing microprocessor designers. Rapid power variation brings transient errors. High power densities bring high temperatures, harming reliability and increasing leakage power. The wages of power are bulky, short-lived batteries, huge heat sinks, large on-die capacitors, high server electric bills, and unreliable microprocessors. Optimizing power depends on accurate and efficient modeling that spans different disciplines and levels, from device physics, to numerical methods, to microarchitectural design.

Original languageEnglish (US)
Pages (from-to)49-62
Number of pages14
JournalIEEE Micro
Volume27
Issue number3
DOIs
StatePublished - May 2007

Keywords

  • Modeling of computer architecture
  • Power models
  • Process variation
  • Reliability models
  • Thermal analysis

ASJC Scopus subject areas

  • Software
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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