Prediction of interface dielectric relaxations in bimodal brush functionalized epoxy nanodielectrics by finite element analysis method

Yanhui Huang, Timothy M. Krentz, J. Keith Nelson, Linda S. Schadler, Yang Li, He Zhao, L. Catherine Brinson, Michael Bell, Brian Benicewicz, Ke Wu, Curt M. Breneman

Research output: Chapter in Book/Report/Conference proceedingConference contribution

15 Scopus citations

Abstract

Finite element 2-D analysis was implemented to simulate the dielectric spectra of nanodielectrics. As a test case, silica modified with a high graft density of short molecules and a low graft density of epoxy compatible chains were incorporated into epoxy. TEM images of the composites filler distribution were used to construct the model geometry with the interfacial area specifically included. The interfacial area was found to have dielectric relaxation behavior different from that of the matrix, as described by additional fitting parameters. This modeling method has the potential to improve our understanding of the impact of interface properties on the dielectric properties of composites.

Original languageEnglish (US)
Title of host publication2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages748-751
Number of pages4
ISBN (Electronic)9781479975235
DOIs
StatePublished - Dec 22 2014
Event2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014 - Des Moines, United States
Duration: Oct 19 2014Oct 22 2014

Publication series

Name2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014

Other

Other2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014
Country/TerritoryUnited States
CityDes Moines
Period10/19/1410/22/14

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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