Printable, flexible, and stretchable forms of ultrananocrystalline diamond with applications in thermal management

Tae Ho Kim*, Won Mook Choi, Dae Hyeong Kim, Matthew A. Meitl, Etienne Menard, Hanqing Jiang, John A. Carlisle, John A. Rogers

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

66 Scopus citations

Abstract

Etching and printing techniques that are used to manipulate thin film microstructures of diamond in a way that allows integration with substrates and creation of structural forms that are incompatible with conventional processing was investigated. A SiO2 layer was deposited by plasma-enhanced chemical vapor deposition (PECVD) using SiH4 and N2O at 250°C. Photolithography with AZ 5214 defined a pattern of photoresist (PR) on the surface of the SiO2 (300 nm)/UNCD (400 nm)/SiO2/Si substrate. The PR served as a mask for RIE etching of the PECVD SiO2 layer with a Cf4 plasma. It was observed that the resulting capabilities could be useful for certain applications, such as those in thermal management for plastic electronics.

Original languageEnglish (US)
Pages (from-to)2171-2176
Number of pages6
JournalAdvanced Materials
Volume20
Issue number11
DOIs
StatePublished - Jun 4 2008

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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