Abstract
Plastic electronic materials and high resolution printing methods may be important technologies for new classes of consumer electronic devices that are lightweight, mechanically flexible and bendable, and which can cover large areas at low cost. This paper summarizes some of our recent work in this area. It focuses on the materials and patterning techniques that we used to produce plastic active matrix backplane circuits for a type of paperlike display. It also presents some strategies for encapsulating and enhancing the bendablity of these devices.
Original language | English (US) |
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Title of host publication | International Conference on Digital Printing Technologies |
Pages | 388-391 |
Number of pages | 4 |
State | Published - Dec 1 2002 |
Event | IS and T's NIP18: International Conference On Digital Printing Technologies - San Diego, CA, United States Duration: Sep 29 2002 → Oct 4 2002 |
Other
Other | IS and T's NIP18: International Conference On Digital Printing Technologies |
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Country/Territory | United States |
City | San Diego, CA |
Period | 9/29/02 → 10/4/02 |
ASJC Scopus subject areas
- Media Technology
- Computer Science Applications