Probing buried defects in extreme ultraviolet multilayer blanks using ultrasound holography

Gajendra S. Shekhawat; Shraddha Avasthy; Arvind K. Srivastava; Soo Hyun Tark; Vinayak P. Dravid

doi:10.1109/TNANO.2010.2053556

Probing buried defects in extreme ultraviolet multilayer blanks using ultrasound holography

Gajendra S. Shekhawat, Shraddha Avasthy, Arvind K. Srivastava, Soo Hyun Tark, Vinayak P. Dravid

Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

23 Scopus citations

Abstract

Imaging high-resolution subsurface defects nondestructively in MoSi multilayer (ML) blanks used in extreme ultraviolet lithography is a challenge and no known metrology tools are available to identify such defects in a nondestructive way. The understanding of their growth mechanism during ML deposition necessitates the monitoring of these defects, which can then lead to fabricating defect-free ML blanks. Here, we report for the first time, a unique and novel application of scanning near-field ultrasound holography (SNFUH) in nondestructive imaging of high-resolution e-beam patterned lines and bumps buried under Mo/Si ML film stacks used for ultraviolet lithography. Our results indicate the successful identification of buried defects under ML blanks using SNFUH.

Original language	English (US)
Article number	5491187
Pages (from-to)	671-674
Number of pages	4
Journal	IEEE Transactions on Nanotechnology
Volume	9
Issue number	6
DOIs	https://doi.org/10.1109/TNANO.2010.2053556
State	Published - Nov 2010

Funding

Manuscript received October 26, 2009; revised January 29, 2010, March 11, 2010, and April 12, 2010; accepted May 20, 2010. Date of publication June 21, 2010; date of current version November 10, 2010. This work was supported by gift from Intel Corporation and by National Science Foundation (NSF)-Major Research Instrumentation Program (MRI), NSF-Instrument Development for Biological Research (IDBR), and Semiconductor Research Corporation (SRC) programs. This work was carried out at the Nanoscale Integrated Fabrication, Testing and Instrumentation (NIFTI) facility of Atomic-and Nanoscale Characterization Experimental Center (NUANCE) at Northwestern University, which is supported by NSF-NSEC (Nano Scale Science and Engineering Center), NSF-Materials Research Science and Engineering Centers (MRSEC), Keck Foundation, the State of Illinois, and Northwestern University. The review of this paper was arranged by Associate Editor A. A. Balandin.

Keywords

Defect detection
metrology
near field
ultrasonics

ASJC Scopus subject areas

Computer Science Applications
Electrical and Electronic Engineering

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10.1109/TNANO.2010.2053556

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title = "Probing buried defects in extreme ultraviolet multilayer blanks using ultrasound holography",

abstract = "Imaging high-resolution subsurface defects nondestructively in MoSi multilayer (ML) blanks used in extreme ultraviolet lithography is a challenge and no known metrology tools are available to identify such defects in a nondestructive way. The understanding of their growth mechanism during ML deposition necessitates the monitoring of these defects, which can then lead to fabricating defect-free ML blanks. Here, we report for the first time, a unique and novel application of scanning near-field ultrasound holography (SNFUH) in nondestructive imaging of high-resolution e-beam patterned lines and bumps buried under Mo/Si ML film stacks used for ultraviolet lithography. Our results indicate the successful identification of buried defects under ML blanks using SNFUH.",

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note = "Funding Information: Manuscript received October 26, 2009; revised January 29, 2010, March 11, 2010, and April 12, 2010; accepted May 20, 2010. Date of publication June 21, 2010; date of current version November 10, 2010. This work was supported by gift from Intel Corporation and by National Science Foundation (NSF)-Major Research Instrumentation Program (MRI), NSF-Instrument Development for Biological Research (IDBR), and Semiconductor Research Corporation (SRC) programs. This work was carried out at the Nanoscale Integrated Fabrication, Testing and Instrumentation (NIFTI) facility of Atomic-and Nanoscale Characterization Experimental Center (NUANCE) at Northwestern University, which is supported by NSF-NSEC (Nano Scale Science and Engineering Center), NSF-Materials Research Science and Engineering Centers (MRSEC), Keck Foundation, the State of Illinois, and Northwestern University. The review of this paper was arranged by Associate Editor A. A. Balandin.",

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N2 - Imaging high-resolution subsurface defects nondestructively in MoSi multilayer (ML) blanks used in extreme ultraviolet lithography is a challenge and no known metrology tools are available to identify such defects in a nondestructive way. The understanding of their growth mechanism during ML deposition necessitates the monitoring of these defects, which can then lead to fabricating defect-free ML blanks. Here, we report for the first time, a unique and novel application of scanning near-field ultrasound holography (SNFUH) in nondestructive imaging of high-resolution e-beam patterned lines and bumps buried under Mo/Si ML film stacks used for ultraviolet lithography. Our results indicate the successful identification of buried defects under ML blanks using SNFUH.

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Probing buried defects in extreme ultraviolet multilayer blanks using ultrasound holography

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