Process modeling of projection micro stereo lithography for three-dimensional MEMS

Cheng Sun*, Nicholas Fang, Xiang Zhang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We present in this paper a high-resolution projection micro stereo lithography (PμSL) process by using a spatial light modulator as the dynamic mask. This unique technology provides a parallel fabrication of highly complex 3D microstrucrures for MEMS. Based on the understanding of underlying mechanism, the process model has been developed and verified by experiment. The UV doping effect has been examined as it can effectively reduce the curing depth without compromising the chemical property of the resin. Finally, the fabrication of complex 3D microstructures, such as matrix, micro-spring array, with the smallest feature of 10 μm has been reported.

Original languageEnglish (US)
Title of host publicationASME International Mechanical Engineering Congress and Exposition, Proceedings
Pages3385-3390
Number of pages6
Volume2
StatePublished - Dec 1 2001
Event2001 ASME International Mechanical Engineering Congress and Exposition - New York, NY, United States
Duration: Nov 11 2001Nov 16 2001

Other

Other2001 ASME International Mechanical Engineering Congress and Exposition
CountryUnited States
CityNew York, NY
Period11/11/0111/16/01

ASJC Scopus subject areas

  • Engineering(all)

Fingerprint Dive into the research topics of 'Process modeling of projection micro stereo lithography for three-dimensional MEMS'. Together they form a unique fingerprint.

  • Cite this

    Sun, C., Fang, N., & Zhang, X. (2001). Process modeling of projection micro stereo lithography for three-dimensional MEMS. In ASME International Mechanical Engineering Congress and Exposition, Proceedings (Vol. 2, pp. 3385-3390)