Progress in the development of segmented thermoelectric unicouples at the Jet Propulsion Laboratory

T. Caillat*, J. P. Fleurial, G. J. Snyder, A. Borshchevsky

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

Abstract

A new version of a segmented thermoelectric unicouple incorporating advanced thermoelectric materials with superior thermoelectric figures of merit has been recently proposed and is currently under development at the Jet Propulsion Laboratory (JPL). This advanced segmented thermoelectric unicouple includes a combination of state-of-the-art thermoelectric materials based on Bi2Te3 and novel materials developed at JPL. The segmented unicouple currently being developed is expected to operate between 300 and about 975K with a projected thermal to electrical efficiency of up to 15%. The segmentation can be adjusted to accommodate various hot-side temperatures depending on the specific application envisioned. Techniques and materials have been developed to bond the different thermoelectric segments together for the n-and p-legs and low contact resistance bonds have been achieved. In order to experimentally determine the thermal to electrical efficiency of the unicouple, metallic interconnects must be developed for the hot side of the thermocouple to connect the n- and p-legs electrically. The latest results in the development of these interconnects are described in this paper. Efforts are also focusing on the fabrication of a unicouple specifically designed for thermal and electrical testing.

Original languageEnglish (US)
JournalProceedings - IEEE International Symposium on Circuits and Systems
Volume4
StatePublished - Jan 1 2001
EventIEEE International Symposium on Circuits and Systems (ISCAS 2001) - Sydney, NSW, Australia
Duration: May 6 2001May 9 2001

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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