Abstract
We describe an experimental method useful for in-situ real-time evaluation of visco-elastic, thermal and adhesive properties of thin films and multi-layer structures. We demonstrate how the technique is used to quantify the elastic moduli, and in-plane thermal diffusivity. We also show how it can be used to `spot check' for dis-bonds and to generate dis-bond `maps'.
Original language | English (US) |
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Pages (from-to) | 553-563 |
Number of pages | 11 |
Journal | Materials Research Society Symposium - Proceedings |
Volume | 338 |
DOIs | |
State | Published - 1994 |
Event | Proceedings of the 1994 MRS Spring Meeting - San Francisco, CA, USA Duration: Apr 5 1994 → Apr 8 1994 |
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering