Real-time thermo-mechanical property evaluation of thin films

John A. Rogers*, K. A. Nelson

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

We describe an experimental method capable of evaluating the elastic and loss moduli and the thermal diffusivity in thin films. The versatility of the technique is demonstrated with data scans from several films of technological interest.

Original languageEnglish (US)
Title of host publicationDiagnostic Techniques for Semiconductor Materials Processing
PublisherPubl by Materials Research Society
Pages317-321
Number of pages5
Volume324
ISBN (Print)1558992235
StatePublished - Jan 1 1994
EventProceedings of the 1993 Fall Meeting of the Materials Research Society - Boston, MA, USA
Duration: Nov 29 1993Dec 2 1993

Other

OtherProceedings of the 1993 Fall Meeting of the Materials Research Society
CityBoston, MA, USA
Period11/29/9312/2/93

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Engineering(all)
  • Earth and Planetary Sciences(all)
  • Environmental Science(all)

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