Region-of-interest microtomography for component inspection

Andrew R. Kalukin*, Denis T. Keane, Wayne G. Roberge

*Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    7 Scopus citations

    Abstract

    The authors describe a novel technique for the nondestructive evaluation of microelectronic components using Xray microtomography. Existing microtomography systems have spatial resolution of order 1 -4im but require X-ray source brilliance that would become unachievable at higher resolutions. The authors describe an imaging method that reduces the number of X-ray photons required from the source without degrading the resolution. The feasibility of the technique is demonstrated through a series of computer simulations. The results are verified with real data from synchrotron experiments.

    Original languageEnglish (US)
    Pages (from-to)36-41
    Number of pages6
    JournalIEEE Transactions on Nuclear Science
    Volume46
    Issue number1
    DOIs
    StatePublished - 1999

    Keywords

    • Component inspection
    • Imaging
    • Inspection
    • Microelectronics
    • Microtomography
    • Quality control
    • X rays

    ASJC Scopus subject areas

    • Nuclear and High Energy Physics
    • Nuclear Energy and Engineering
    • Electrical and Electronic Engineering

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