Region-of-interest microtomography for component inspection

Andrew R. Kalukin*, Denis T. Keane, Wayne G. Roberge

*Corresponding author for this work

Research output: Contribution to journalArticle

7 Scopus citations

Abstract

The authors describe a novel technique for the nondestructive evaluation of microelectronic components using Xray microtomography. Existing microtomography systems have spatial resolution of order 1 -4im but require X-ray source brilliance that would become unachievable at higher resolutions. The authors describe an imaging method that reduces the number of X-ray photons required from the source without degrading the resolution. The feasibility of the technique is demonstrated through a series of computer simulations. The results are verified with real data from synchrotron experiments.

Original languageEnglish (US)
Pages (from-to)36-41
Number of pages6
JournalIEEE Transactions on Nuclear Science
Volume46
Issue number1
DOIs
StatePublished - Dec 1 1999

Keywords

  • Component inspection
  • Imaging
  • Inspection
  • Microelectronics
  • Microtomography
  • Quality control
  • X rays

ASJC Scopus subject areas

  • Nuclear and High Energy Physics
  • Nuclear Energy and Engineering
  • Electrical and Electronic Engineering

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