Reliability modeling and management of nanophotonic on-chip networks

Zheng Li*, Moustafa Mohamed, Xi Chen, Eric Dudley, Ke Meng, Li Shang, Alan R. Mickelson, Russell E Joseph, Manish Vachharajani, Brian Schwartz, Yihe Sun

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

74 Scopus citations


While transistor performance and energy efficiency have dramatically improved in recent years, electrical interconnect improvements has failed to keep pace. Recent advances in nanophotonic fabrication have made on-chip optics an attractive alternative. However, system integration challenges remain. In particular, the parameters of on-chip nanophotonic structures are sensitive to fabrication-induced process variation and run-time spatial thermal variation across the die. This work addresses the performance and reliability challenges that arise from this sensitivity to variation. The paper first presents a model predicting the system-level effects of thermal and process variation in nanophotonic networks. It then shows how to optimize many-core system performance and reliability by using run-time techniques to compensate for the thermal and process variation effects.

Original languageEnglish (US)
Article number5664817
Pages (from-to)98-111
Number of pages14
JournalIEEE Transactions on Very Large Scale Integration (VLSI) Systems
Issue number1
StatePublished - Jan 2012


  • Multicore processing
  • Multiprocessor interconnection networks
  • Nanophotonics
  • Reliability

ASJC Scopus subject areas

  • Software
  • Hardware and Architecture
  • Electrical and Electronic Engineering


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