Research on single-point diamond fly-grooving of brittle materials

Y. Peng*, T. Jiang, K. F. Ehmann

*Corresponding author for this work

Research output: Contribution to journalArticle

14 Scopus citations

Abstract

The purpose of this paper is to investigate the machining mechanisms that accompany the single-point diamond fly-cutting operation in grooving of brittle materials. Single-point diamond fly-cutting is widely used in precision machining of free-form optics, semiconductor devices, and micro-electromechanical system (MEMS) components among many others. The undeformed chip zone was analyzed and its relation to the critical brittle/ductile transition depth of cut was discussed. Then, a mechanics-based model was proposed to describe the material stress condition under the diamond tool. The machining parameters were incorporated into the model to understand fly-cutting behavior. It was shown that the fly-cutting technique is highly suitable for the ductile removal of brittle materials by generating large compressive pressures in the chip formation zone. This condition can be further enhanced by a small feedrate and a large negative rake angle of the diamond tool used. The theoretical results were substantiated and verified by fly-grooving experiments performed on mono-crystalline silicon.

Original languageEnglish (US)
Pages (from-to)1577-1586
Number of pages10
JournalInternational Journal of Advanced Manufacturing Technology
Volume75
Issue number9-12
DOIs
StatePublished - Nov 16 2014

Keywords

  • Brittle materials
  • Diamond fly-cutting
  • Ductile material removal
  • Mechanical model

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Software
  • Mechanical Engineering
  • Computer Science Applications
  • Industrial and Manufacturing Engineering

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