Residual stresses and warpage in woven-glass/epoxy laminates

I. G. Zewi*, Isaac M Daniel, J. T. Gotro

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

22 Scopus citations

Abstract

Residual stresses are introduced in composite laminates during curing as a result of differential thermal expansion of the various plies. Residual stresses coupled with asymmetries in the laminate produce warpage. To study these phenomena, symmetric and asymmetric glass-fabric-reinforced laminates were fabricated. The laminate material was fully characterized by determining its physical and mechanical properties at room and elevated temperatures. Thermal strains during curing and subsequent thermal cycling were measured by means of embedded strain gages. Residual stresses were then calculated using the mechanical properties determined before. Warpage for known types of asymmetry was calculated by means of lamination theory and compared with experimental measurements using a projection moire technique. The residual stresses in the studied laminates were very low, owing to the balancing effect of the woven-fabric reinforcement. A crossplied antisymmetric laminate showed saddle-shaped warpage in agreement with the analytical prediction. Unexpected warpage found in symmetric laminates may be due to imperfections in fiber orientations and/or temperature nonuniformities during laminations.

Original languageEnglish (US)
Pages (from-to)44-50
Number of pages7
JournalExperimental Mechanics
Volume27
Issue number1
DOIs
StatePublished - Mar 1 1987

ASJC Scopus subject areas

  • Aerospace Engineering
  • Mechanics of Materials
  • Mechanical Engineering

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