Rubber stamped plastic circuits for electronic paper

J. A. Rogers*, K. Baldwin, Z. Bao, A. Dodabalapur, V. R. Raju, J. Ewing, K. Amundson

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

This paper illustrates the use of a high resolution form of rubber stamping, known as microcontact printing (μCP), for patterning plastic active matrix drive circuitry designed for electronic paper. The high resolution (∼1 μm) of the printed elements, the large area coverage (∼1 sq. ft.) and the good electrical performance of these systems suggest that the methods, materials and processing sequences may be attractive for realistic applications of plastic electronics.

Original languageEnglish (US)
Title of host publicationProceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces
Pages98-103
Number of pages6
StatePublished - Jan 1 2001
EventInternational Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, United States
Duration: Mar 11 2001Mar 14 2001

Other

OtherInternational Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces
Country/TerritoryUnited States
CityBraselton, GA
Period3/11/013/14/01

ASJC Scopus subject areas

  • Materials Science(all)
  • Engineering(all)

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