Rubber stamped plastic circuits for electronic paper

J. A. Rogers; K. Baldwin; Z. Bao; A. Dodabalapur; V. R. Raju; J. Ewing; K. Amundson

Rubber stamped plastic circuits for electronic paper

J. A. Rogers^*, K. Baldwin, Z. Bao, A. Dodabalapur, V. R. Raju, J. Ewing, K. Amundson

^*Corresponding author for this work

Materials Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

This paper illustrates the use of a high resolution form of rubber stamping, known as microcontact printing (μCP), for patterning plastic active matrix drive circuitry designed for electronic paper. The high resolution (∼1 μm) of the printed elements, the large area coverage (∼1 sq. ft.) and the good electrical performance of these systems suggest that the methods, materials and processing sequences may be attractive for realistic applications of plastic electronics.

Original language	English (US)
Title of host publication	Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces
Pages	98-103
Number of pages	6
State	Published - Jan 1 2001
Event	International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, United States Duration: Mar 11 2001 → Mar 14 2001

Other

Other	International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces
Country/Territory	United States
City	Braselton, GA
Period	3/11/01 → 3/14/01

ASJC Scopus subject areas

Materials Science(all)
Engineering(all)

Cite this

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title = "Rubber stamped plastic circuits for electronic paper",

abstract = "This paper illustrates the use of a high resolution form of rubber stamping, known as microcontact printing (μCP), for patterning plastic active matrix drive circuitry designed for electronic paper. The high resolution (∼1 μm) of the printed elements, the large area coverage (∼1 sq. ft.) and the good electrical performance of these systems suggest that the methods, materials and processing sequences may be attractive for realistic applications of plastic electronics.",

author = "Rogers, {J. A.} and K. Baldwin and Z. Bao and A. Dodabalapur and Raju, {V. R.} and J. Ewing and K. Amundson",

year = "2001",

month = jan,

day = "1",

language = "English (US)",

pages = "98--103",

booktitle = "Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces",

note = "International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces ; Conference date: 11-03-2001 Through 14-03-2001",

}

Rogers, JA, Baldwin, K, Bao, Z, Dodabalapur, A, Raju, VR, Ewing, J & Amundson, K 2001, Rubber stamped plastic circuits for electronic paper. in Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces. pp. 98-103, International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, Braselton, GA, United States, 3/11/01.

TY - GEN

T1 - Rubber stamped plastic circuits for electronic paper

AU - Rogers, J. A.

AU - Baldwin, K.

AU - Bao, Z.

AU - Dodabalapur, A.

AU - Raju, V. R.

AU - Ewing, J.

AU - Amundson, K.

PY - 2001/1/1

Y1 - 2001/1/1

N2 - This paper illustrates the use of a high resolution form of rubber stamping, known as microcontact printing (μCP), for patterning plastic active matrix drive circuitry designed for electronic paper. The high resolution (∼1 μm) of the printed elements, the large area coverage (∼1 sq. ft.) and the good electrical performance of these systems suggest that the methods, materials and processing sequences may be attractive for realistic applications of plastic electronics.

AB - This paper illustrates the use of a high resolution form of rubber stamping, known as microcontact printing (μCP), for patterning plastic active matrix drive circuitry designed for electronic paper. The high resolution (∼1 μm) of the printed elements, the large area coverage (∼1 sq. ft.) and the good electrical performance of these systems suggest that the methods, materials and processing sequences may be attractive for realistic applications of plastic electronics.

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M3 - Conference contribution

AN - SCOPUS:0034996139

SP - 98

EP - 103

BT - Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

T2 - International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Y2 - 11 March 2001 through 14 March 2001

ER -

Rubber stamped plastic circuits for electronic paper

Abstract

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ASJC Scopus subject areas

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