Abstract
This paper illustrates the use of a high resolution form of rubber stamping, known as microcontact printing (μCP), for patterning plastic active matrix drive circuitry designed for electronic paper. The high resolution (∼1 μm) of the printed elements, the large area coverage (∼1 sq. ft.) and the good electrical performance of these systems suggest that the methods, materials and processing sequences may be attractive for realistic applications of plastic electronics.
Original language | English (US) |
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Title of host publication | Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces |
Pages | 98-103 |
Number of pages | 6 |
State | Published - Jan 1 2001 |
Event | International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, United States Duration: Mar 11 2001 → Mar 14 2001 |
Other
Other | International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces |
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Country/Territory | United States |
City | Braselton, GA |
Period | 3/11/01 → 3/14/01 |
ASJC Scopus subject areas
- Materials Science(all)
- Engineering(all)