Seeing inside chips and cells: High-resolution subsurface imaging of integrated circuits, quantum dots and subcellular structures

Bennett B. Goldberg*, A. K. Swan, L. Moiseev, M. Dogan, W. C. Karl, B. Davis, C. R. Cantor, S. B. Ippolito, S. A. Thorne, M. G. Eraslan, Z. Liu, M. B. Goldberg, M. S. Ünlü, Y. Leblebici

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

Abstract

In this work we examine two general approaches to subsurface imaging, the first using solid immersion lens technology to optimize the numerical aperture and the second an interferometric spectral fluorescence technique for buried emitters.

Original languageEnglish (US)
Pages (from-to)673-674
Number of pages2
JournalOSA Trends in Optics and Photonics Series
Volume97
StatePublished - 2004
EventInternational Quantum Electronics Conference, IQEC - San Francisco, CA, United States
Duration: May 21 2004May 26 2004

Keywords

  • Fluorescence imaging
  • High-resolution
  • Spectroscopy
  • Thermal imaging

ASJC Scopus subject areas

  • General Engineering

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