Self-assembled three dimensional network designs for soft electronics

Kyung In Jang, Kan Li, Ha Uk Chung, Sheng Xu, Han Na Jung, Yiyuan Yang, Jean Won Kwak, Han Hee Jung, Juwon Song, Ce Yang, Ao Wang, Zhuangjian Liu, Jong Yoon Lee, Bong Hoon Kim, Jae Hwan Kim, Jungyup Lee, Yongjoon Yu, Bum Jun Kim, Hokyung Jang, Ki Jun Yu & 7 others Jeonghyun Kim, Jung Woo Lee, Jae Woong Jeong, Young Min Song, Yonggang Huang, Yihui Zhang, John A Rogers

Research output: Contribution to journalArticle

80 Citations (Scopus)

Abstract

Low modulus, compliant systems of sensors, circuits and radios designed to intimately interface with the soft tissues of the human body are of growing interest, due to their emerging applications in continuous, clinical-quality health monitors and advanced, bioelectronic therapeutics. Although recent research establishes various materials and mechanics concepts for such technologies, all existing approaches involve simple, two-dimensional (2D) layouts in the constituent micro-components and interconnects. Here we introduce concepts in three-dimensional (3D) architectures that bypass important engineering constraints and performance limitations set by traditional, 2D designs. Specifically, open-mesh, 3D interconnect networks of helical microcoils formed by deterministic compressive buckling establish the basis for systems that can offer exceptional low modulus, elastic mechanics, in compact geometries, with active components and sophisticated levels of functionality. Coupled mechanical and electrical design approaches enable layout optimization, assembly processes and encapsulation schemes to yield 3D configurations that satisfy requirements in demanding, complex systems, such as wireless, skin-compatible electronic sensors.

Original languageEnglish (US)
Article number15894
JournalNature communications
Volume8
DOIs
StatePublished - Jun 21 2017

Fingerprint

Mechanics
layouts
Electronic equipment
Radio receivers
Elastic Modulus
bypasses
sensors
Sensors
human body
buckling
complex systems
Radio
Human Body
Encapsulation
electronics
health
Buckling
monitors
Large scale systems
mesh

ASJC Scopus subject areas

  • Chemistry(all)
  • Biochemistry, Genetics and Molecular Biology(all)
  • Physics and Astronomy(all)

Cite this

Jang, Kyung In ; Li, Kan ; Chung, Ha Uk ; Xu, Sheng ; Jung, Han Na ; Yang, Yiyuan ; Kwak, Jean Won ; Jung, Han Hee ; Song, Juwon ; Yang, Ce ; Wang, Ao ; Liu, Zhuangjian ; Lee, Jong Yoon ; Kim, Bong Hoon ; Kim, Jae Hwan ; Lee, Jungyup ; Yu, Yongjoon ; Kim, Bum Jun ; Jang, Hokyung ; Yu, Ki Jun ; Kim, Jeonghyun ; Lee, Jung Woo ; Jeong, Jae Woong ; Song, Young Min ; Huang, Yonggang ; Zhang, Yihui ; Rogers, John A. / Self-assembled three dimensional network designs for soft electronics. In: Nature communications. 2017 ; Vol. 8.
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abstract = "Low modulus, compliant systems of sensors, circuits and radios designed to intimately interface with the soft tissues of the human body are of growing interest, due to their emerging applications in continuous, clinical-quality health monitors and advanced, bioelectronic therapeutics. Although recent research establishes various materials and mechanics concepts for such technologies, all existing approaches involve simple, two-dimensional (2D) layouts in the constituent micro-components and interconnects. Here we introduce concepts in three-dimensional (3D) architectures that bypass important engineering constraints and performance limitations set by traditional, 2D designs. Specifically, open-mesh, 3D interconnect networks of helical microcoils formed by deterministic compressive buckling establish the basis for systems that can offer exceptional low modulus, elastic mechanics, in compact geometries, with active components and sophisticated levels of functionality. Coupled mechanical and electrical design approaches enable layout optimization, assembly processes and encapsulation schemes to yield 3D configurations that satisfy requirements in demanding, complex systems, such as wireless, skin-compatible electronic sensors.",
author = "Jang, {Kyung In} and Kan Li and Chung, {Ha Uk} and Sheng Xu and Jung, {Han Na} and Yiyuan Yang and Kwak, {Jean Won} and Jung, {Han Hee} and Juwon Song and Ce Yang and Ao Wang and Zhuangjian Liu and Lee, {Jong Yoon} and Kim, {Bong Hoon} and Kim, {Jae Hwan} and Jungyup Lee and Yongjoon Yu and Kim, {Bum Jun} and Hokyung Jang and Yu, {Ki Jun} and Jeonghyun Kim and Lee, {Jung Woo} and Jeong, {Jae Woong} and Song, {Young Min} and Yonggang Huang and Yihui Zhang and Rogers, {John A}",
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Jang, KI, Li, K, Chung, HU, Xu, S, Jung, HN, Yang, Y, Kwak, JW, Jung, HH, Song, J, Yang, C, Wang, A, Liu, Z, Lee, JY, Kim, BH, Kim, JH, Lee, J, Yu, Y, Kim, BJ, Jang, H, Yu, KJ, Kim, J, Lee, JW, Jeong, JW, Song, YM, Huang, Y, Zhang, Y & Rogers, JA 2017, 'Self-assembled three dimensional network designs for soft electronics', Nature communications, vol. 8, 15894. https://doi.org/10.1038/ncomms15894

Self-assembled three dimensional network designs for soft electronics. / Jang, Kyung In; Li, Kan; Chung, Ha Uk; Xu, Sheng; Jung, Han Na; Yang, Yiyuan; Kwak, Jean Won; Jung, Han Hee; Song, Juwon; Yang, Ce; Wang, Ao; Liu, Zhuangjian; Lee, Jong Yoon; Kim, Bong Hoon; Kim, Jae Hwan; Lee, Jungyup; Yu, Yongjoon; Kim, Bum Jun; Jang, Hokyung; Yu, Ki Jun; Kim, Jeonghyun; Lee, Jung Woo; Jeong, Jae Woong; Song, Young Min; Huang, Yonggang; Zhang, Yihui; Rogers, John A.

In: Nature communications, Vol. 8, 15894, 21.06.2017.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Self-assembled three dimensional network designs for soft electronics

AU - Jang, Kyung In

AU - Li, Kan

AU - Chung, Ha Uk

AU - Xu, Sheng

AU - Jung, Han Na

AU - Yang, Yiyuan

AU - Kwak, Jean Won

AU - Jung, Han Hee

AU - Song, Juwon

AU - Yang, Ce

AU - Wang, Ao

AU - Liu, Zhuangjian

AU - Lee, Jong Yoon

AU - Kim, Bong Hoon

AU - Kim, Jae Hwan

AU - Lee, Jungyup

AU - Yu, Yongjoon

AU - Kim, Bum Jun

AU - Jang, Hokyung

AU - Yu, Ki Jun

AU - Kim, Jeonghyun

AU - Lee, Jung Woo

AU - Jeong, Jae Woong

AU - Song, Young Min

AU - Huang, Yonggang

AU - Zhang, Yihui

AU - Rogers, John A

PY - 2017/6/21

Y1 - 2017/6/21

N2 - Low modulus, compliant systems of sensors, circuits and radios designed to intimately interface with the soft tissues of the human body are of growing interest, due to their emerging applications in continuous, clinical-quality health monitors and advanced, bioelectronic therapeutics. Although recent research establishes various materials and mechanics concepts for such technologies, all existing approaches involve simple, two-dimensional (2D) layouts in the constituent micro-components and interconnects. Here we introduce concepts in three-dimensional (3D) architectures that bypass important engineering constraints and performance limitations set by traditional, 2D designs. Specifically, open-mesh, 3D interconnect networks of helical microcoils formed by deterministic compressive buckling establish the basis for systems that can offer exceptional low modulus, elastic mechanics, in compact geometries, with active components and sophisticated levels of functionality. Coupled mechanical and electrical design approaches enable layout optimization, assembly processes and encapsulation schemes to yield 3D configurations that satisfy requirements in demanding, complex systems, such as wireless, skin-compatible electronic sensors.

AB - Low modulus, compliant systems of sensors, circuits and radios designed to intimately interface with the soft tissues of the human body are of growing interest, due to their emerging applications in continuous, clinical-quality health monitors and advanced, bioelectronic therapeutics. Although recent research establishes various materials and mechanics concepts for such technologies, all existing approaches involve simple, two-dimensional (2D) layouts in the constituent micro-components and interconnects. Here we introduce concepts in three-dimensional (3D) architectures that bypass important engineering constraints and performance limitations set by traditional, 2D designs. Specifically, open-mesh, 3D interconnect networks of helical microcoils formed by deterministic compressive buckling establish the basis for systems that can offer exceptional low modulus, elastic mechanics, in compact geometries, with active components and sophisticated levels of functionality. Coupled mechanical and electrical design approaches enable layout optimization, assembly processes and encapsulation schemes to yield 3D configurations that satisfy requirements in demanding, complex systems, such as wireless, skin-compatible electronic sensors.

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