Self-heating-aware optimal wire sizing under Elmore delay model

Min Ni*, Seda Ogrenci Memik

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Scopus citations

Abstract

Global interconnect temperature keeps rising in the current and future technologies due to self-heating and the adiabatic property of top metal layers. The thermal effects impact adversely both reliability and performance of the interconnect wire, shortening the interconnect lifetime and increasing the interconnect delay. Such effects must be considered during the process of interconnect design. In this paper, one important argument is that the traditional linear dependence between wire resistance and wire width is no longer adequate for high layer interconnects due to the adiabatic property of these wires. By using curve fitting technique, we propose a quadratic model to represent the resistance of interconnect, which is aware of the thermal effects. Based on this model and the Elmore delay model, we derived a linear optimal wire sizing formula in form of f(x) = ax + b. Compared to non-thermal-aware exponential wire sizing formula inform of f(x) = ae-bx, we observed a 49.7% average delay gain with different choices of physical parameters.

Original languageEnglish (US)
Title of host publicationProceedings - 2007 Design, Automation and Test in Europe Conference and Exhibition, DATE 2007
Pages1373-1378
Number of pages6
DOIs
StatePublished - Sep 4 2007
Event2007 Design, Automation and Test in Europe Conference and Exhibition - Nice Acropolis, France
Duration: Apr 16 2007Apr 20 2007

Other

Other2007 Design, Automation and Test in Europe Conference and Exhibition
CountryFrance
CityNice Acropolis
Period4/16/074/20/07

ASJC Scopus subject areas

  • Engineering(all)

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