Shear strength and fracture behavior of reflowed Sn3.0Ag0.5Cu/Cu solder joints under various strain rates

Xiaowu Hu, Tao Xu, Leon M. Keer, Yulong Li*, Xiongxin Jiang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

34 Scopus citations

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Chemical Compounds

Engineering & Materials Science