Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing

C. C. Li; F. Drymiotis; L. L. Liao; M. J. Dai; C. K. Liu; C. L. Chen; Y. Y. Chen; C. R. Kao; G. J. Snyder

doi:10.1016/j.enconman.2015.03.089

Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing

C. C. Li, F. Drymiotis, L. L. Liao, M. J. Dai, C. K. Liu, C. L. Chen, Y. Y. Chen, C. R. Kao^*, G. J. Snyder

^*Corresponding author for this work

Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

27 Scopus citations

Abstract

We use the rapid hot-pressing method to bond Ag foil onto pure PbTe in order to assess its effectiveness as a bonding layer material for thermoelectric module applications. Scanning electron microscopy and X-ray diffraction are employed to examine intermetallic compound formation and microstructure evolution during isothermal aging at 400 °C and 550 °C. We find that Ag is a promising bonding material for PbTe modules operating at T_Hot ≤ 400 °C. Additionally, our approach highlights a highly effective and inexpensive method to metallize PbTe prior to module assembly.

Original language	English (US)
Pages (from-to)	134-137
Number of pages	4
Journal	Energy Conversion and Management
Volume	98
DOIs	https://doi.org/10.1016/j.enconman.2015.03.089
State	Published - Jul 1 2015

Funding

This work is financially supported by National Science Council of Taiwan through Grant 101-2221-E-002-162-MY3 , the Electronics and Optoelectronics Research Laboratories of Industrial Technology Research Institute , and the Caltech DOW-Bridge program.

Keywords

Intermetallic compounds
Rapid hot-pressing
Thermal stability
Thermoelectric material

ASJC Scopus subject areas

Renewable Energy, Sustainability and the Environment
Nuclear Energy and Engineering
Fuel Technology
Energy Engineering and Power Technology

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10.1016/j.enconman.2015.03.089

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title = "Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing",

abstract = "We use the rapid hot-pressing method to bond Ag foil onto pure PbTe in order to assess its effectiveness as a bonding layer material for thermoelectric module applications. Scanning electron microscopy and X-ray diffraction are employed to examine intermetallic compound formation and microstructure evolution during isothermal aging at 400 °C and 550 °C. We find that Ag is a promising bonding material for PbTe modules operating at THot ≤ 400 °C. Additionally, our approach highlights a highly effective and inexpensive method to metallize PbTe prior to module assembly.",

keywords = "Intermetallic compounds, Rapid hot-pressing, Thermal stability, Thermoelectric material",

author = "Li, {C. C.} and F. Drymiotis and Liao, {L. L.} and Dai, {M. J.} and Liu, {C. K.} and Chen, {C. L.} and Chen, {Y. Y.} and Kao, {C. R.} and Snyder, {G. J.}",

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doi = "10.1016/j.enconman.2015.03.089",

language = "English (US)",

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TY - JOUR

T1 - Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing

AU - Li, C. C.

AU - Drymiotis, F.

AU - Liao, L. L.

AU - Dai, M. J.

AU - Liu, C. K.

AU - Chen, C. L.

AU - Chen, Y. Y.

AU - Kao, C. R.

AU - Snyder, G. J.

PY - 2015/7/1

Y1 - 2015/7/1

N2 - We use the rapid hot-pressing method to bond Ag foil onto pure PbTe in order to assess its effectiveness as a bonding layer material for thermoelectric module applications. Scanning electron microscopy and X-ray diffraction are employed to examine intermetallic compound formation and microstructure evolution during isothermal aging at 400 °C and 550 °C. We find that Ag is a promising bonding material for PbTe modules operating at THot ≤ 400 °C. Additionally, our approach highlights a highly effective and inexpensive method to metallize PbTe prior to module assembly.

AB - We use the rapid hot-pressing method to bond Ag foil onto pure PbTe in order to assess its effectiveness as a bonding layer material for thermoelectric module applications. Scanning electron microscopy and X-ray diffraction are employed to examine intermetallic compound formation and microstructure evolution during isothermal aging at 400 °C and 550 °C. We find that Ag is a promising bonding material for PbTe modules operating at THot ≤ 400 °C. Additionally, our approach highlights a highly effective and inexpensive method to metallize PbTe prior to module assembly.

KW - Intermetallic compounds

KW - Rapid hot-pressing

KW - Thermal stability

KW - Thermoelectric material

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DO - 10.1016/j.enconman.2015.03.089

M3 - Article

AN - SCOPUS:84926625838

SN - 0196-8904

VL - 98

SP - 134

EP - 137

JO - Energy Conversion and Management

JF - Energy Conversion and Management

ER -

Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing

Abstract

Funding

Keywords

ASJC Scopus subject areas

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