Size reduction and dual mode degeneracy in microstrip patch antenna using periodically rippled silicon substrate

Mohsen Yazdani, Aryan Navabi, Pedram Khalili, Kang Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

A novel fabrication process for periodically rippled transmission lines is presented in this paper. This technique allows for height modulation of microstrip passive components, resulting in size reduction as well as dual mode degeneracy. A 4 mm × 4 mm X-band one dimensional (1D) rippled patch antenna with 6 μm periodicity is designed and fabricated using this technique. A 26% size reduction compared to regular antennas, as well as dual-mode operation is demonstrated in measurements. The measurement results confirm the potential application of the proposed structure in the design of compact dual-band integrated devices on silicon substrates.

Original languageEnglish (US)
Title of host publication2015 IEEE MTT-S International Microwave Symposium, IMS 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479982752
DOIs
StatePublished - Jul 24 2015
EventIEEE MTT-S International Microwave Symposium, IMS 2015 - Phoenix, United States
Duration: May 17 2015May 22 2015

Publication series

Name2015 IEEE MTT-S International Microwave Symposium, IMS 2015

Other

OtherIEEE MTT-S International Microwave Symposium, IMS 2015
CountryUnited States
CityPhoenix
Period5/17/155/22/15

Keywords

  • Dual band antenna
  • Microstrip Patch antenna
  • Miniaturization
  • Nonuniform transmission line
  • Rippled microstrip line

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Signal Processing
  • Electrical and Electronic Engineering

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