TY - GEN
T1 - Solid-liquid interface slip as a rate process
AU - Martini, A.
AU - Lichter, S.
AU - Snurr, R. Q.
AU - Wang, Q.
PY - 2008
Y1 - 2008
N2 - Thin film lubrication may be significantly affected by slip at the solid-liquid interface. Slip occurs when there is a jump in the mean speed between the walls and the first layer of liquid molecules. Using molecular simulation, we show that the amount of slip is greatly affected by solvation pressure and that this dependence can be accounted for by treating slip as a rate process. This treatment enables formulation of a quantitative relationship between solvation pressure and interface slip.
AB - Thin film lubrication may be significantly affected by slip at the solid-liquid interface. Slip occurs when there is a jump in the mean speed between the walls and the first layer of liquid molecules. Using molecular simulation, we show that the amount of slip is greatly affected by solvation pressure and that this dependence can be accounted for by treating slip as a rate process. This treatment enables formulation of a quantitative relationship between solvation pressure and interface slip.
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U2 - 10.1115/IJTC2007-44022
DO - 10.1115/IJTC2007-44022
M3 - Conference contribution
AN - SCOPUS:43449089811
SN - 0791848108
SN - 9780791848104
T3 - 2007 Proceedings of the ASME/STLE International Joint Tribology Conference, IJTC 2007
SP - 773
EP - 774
BT - 2007 Proceedings of the ASME/STLE International Joint Tribology Conference, IJTC 2007
T2 - 2007 ASME/STLE International Joint Tribology Conference, IJTC 2007
Y2 - 22 October 2007 through 24 October 2007
ER -