Solid-liquid interface slip as a rate process

A. Martini*, Seth H Lichter, Randall Q Snurr, Q Jane Wang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Thin film lubrication may be significantly affected by slip at the solid-liquid interface. Slip occurs when there is a jump in the mean speed between the walls and the first layer of liquid molecules. Using molecular simulation, we show that the amount of slip is greatly affected by solvation pressure and that this dependence can be accounted for by treating slip as a rate process. This treatment enables formulation of a quantitative relationship between solvation pressure and interface slip.

Original languageEnglish (US)
Title of host publication2007 Proceedings of the ASME/STLE International Joint Tribology Conference, IJTC 2007
Pages773-774
Number of pages2
VolumePART B
DOIs
StatePublished - May 19 2008
Event2007 ASME/STLE International Joint Tribology Conference, IJTC 2007 - San Diego, CA, United States
Duration: Oct 22 2007Oct 24 2007

Other

Other2007 ASME/STLE International Joint Tribology Conference, IJTC 2007
CountryUnited States
CitySan Diego, CA
Period10/22/0710/24/07

ASJC Scopus subject areas

  • Mechanical Engineering
  • Surfaces, Coatings and Films
  • Condensed Matter Physics
  • Surfaces and Interfaces

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