Solidification processing of Te-Sb-Pb alloys for thermoelectric applications

Y. Ikeda*, H. Azizgolshani, S. M. Haile, G. J. Snyder, V. A. Ravi

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

A solidification processing approach to the refinement of lead-tellurium-antimony alloy microstructure is described. Liquid alloys with eutectic, hyper-eutectic and hypo-eutectic compositions (relative to lead) were cooled to the solid state in three distinct ways, i.e. by water quenching, air cooling and furnace cooling. The structures of the alloys resulting from the three different solidification paths were examined using electron microscopy and the micrographs were quantified. Classical solidification methods were used to interpret the structures in relation to the cooling histories.

Original languageEnglish (US)
Title of host publicationProceedings - ICT'05
Subtitle of host publication24th International Conference on Thermoelectrics
Pages132-135
Number of pages4
DOIs
StatePublished - Dec 1 2005
EventICT'05: 24th International Conference on Thermoelectrics - Clemson, SC, United States
Duration: Jun 19 2005Jun 23 2005

Publication series

NameInternational Conference on Thermoelectrics, ICT, Proceedings
Volume2005

Other

OtherICT'05: 24th International Conference on Thermoelectrics
CountryUnited States
CityClemson, SC
Period6/19/056/23/05

Keywords

  • Dendrite structure
  • Lamella structure
  • Secondary dendrite arm spacing
  • Solidification
  • Tellurium-antimony-lead

ASJC Scopus subject areas

  • Engineering(all)

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    Ikeda, Y., Azizgolshani, H., Haile, S. M., Snyder, G. J., & Ravi, V. A. (2005). Solidification processing of Te-Sb-Pb alloys for thermoelectric applications. In Proceedings - ICT'05: 24th International Conference on Thermoelectrics (pp. 132-135). [1519906] (International Conference on Thermoelectrics, ICT, Proceedings; Vol. 2005). https://doi.org/10.1109/ICT.2005.1519906