Stamp collapse in soft lithography

Yonggang Y. Huang; Weixing Zhou; K. J. Hsia; Etienne Menard; Jang Ung Park; John A. Rogers; Andrew G. Alleyne

doi:10.1021/la0502185

Stamp collapse in soft lithography

Yonggang Y. Huang^*, Weixing Zhou, K. J. Hsia, Etienne Menard, Jang Ung Park, John A. Rogers, Andrew G. Alleyne

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

209 Scopus citations

Abstract

We have studied the so-called roof collapse in soft lithography. Roof collapse is due to the adhesion between the PDMS stamp and substrate, and it may affect the quality of soft lithography. Our analysis accounts for the interactions of multiple punches and the effect of elastic mismatch between the PDMS stamp and substrate. A scaling law among the stamp modulus, punch height and spacing, and work of adhesion between the stamp and substrate is established. Such a scaling law leads to a simple criterion against the unwanted roof collapse. The present study agrees well with the experimental data.

Original language	English (US)
Pages (from-to)	8058-8068
Number of pages	11
Journal	Langmuir
Volume	21
Issue number	17
DOIs	https://doi.org/10.1021/la0502185
State	Published - Aug 16 2005

ASJC Scopus subject areas

General Materials Science
Condensed Matter Physics
Surfaces and Interfaces
Spectroscopy
Electrochemistry

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10.1021/la0502185

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AU - Huang, Yonggang Y.

AU - Zhou, Weixing

AU - Hsia, K. J.

AU - Menard, Etienne

AU - Park, Jang Ung

AU - Rogers, John A.

AU - Alleyne, Andrew G.

PY - 2005/8/16

Y1 - 2005/8/16

N2 - We have studied the so-called roof collapse in soft lithography. Roof collapse is due to the adhesion between the PDMS stamp and substrate, and it may affect the quality of soft lithography. Our analysis accounts for the interactions of multiple punches and the effect of elastic mismatch between the PDMS stamp and substrate. A scaling law among the stamp modulus, punch height and spacing, and work of adhesion between the stamp and substrate is established. Such a scaling law leads to a simple criterion against the unwanted roof collapse. The present study agrees well with the experimental data.

AB - We have studied the so-called roof collapse in soft lithography. Roof collapse is due to the adhesion between the PDMS stamp and substrate, and it may affect the quality of soft lithography. Our analysis accounts for the interactions of multiple punches and the effect of elastic mismatch between the PDMS stamp and substrate. A scaling law among the stamp modulus, punch height and spacing, and work of adhesion between the stamp and substrate is established. Such a scaling law leads to a simple criterion against the unwanted roof collapse. The present study agrees well with the experimental data.

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Stamp collapse in soft lithography

Abstract

ASJC Scopus subject areas

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