Stamp collapse in soft lithography

Yonggang Y. Huang*, Weixing Zhou, K. J. Hsia, Etienne Menard, Jang Ung Park, John A. Rogers, Andrew G. Alleyne

*Corresponding author for this work

Research output: Contribution to journalArticle

178 Scopus citations

Abstract

We have studied the so-called roof collapse in soft lithography. Roof collapse is due to the adhesion between the PDMS stamp and substrate, and it may affect the quality of soft lithography. Our analysis accounts for the interactions of multiple punches and the effect of elastic mismatch between the PDMS stamp and substrate. A scaling law among the stamp modulus, punch height and spacing, and work of adhesion between the stamp and substrate is established. Such a scaling law leads to a simple criterion against the unwanted roof collapse. The present study agrees well with the experimental data.

Original languageEnglish (US)
Pages (from-to)8058-8068
Number of pages11
JournalLangmuir
Volume21
Issue number17
DOIs
StatePublished - Aug 16 2005

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Spectroscopy
  • Electrochemistry

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    Huang, Y. Y., Zhou, W., Hsia, K. J., Menard, E., Park, J. U., Rogers, J. A., & Alleyne, A. G. (2005). Stamp collapse in soft lithography. Langmuir, 21(17), 8058-8068. https://doi.org/10.1021/la0502185