Stamp collapse in soft lithography

Yonggang Y. Huang*, Weixing Zhou, K. J. Hsia, Etienne Menard, Jang Ung Park, John A. Rogers, Andrew G. Alleyne

*Corresponding author for this work

Research output: Contribution to journalArticle

171 Citations (Scopus)

Abstract

We have studied the so-called roof collapse in soft lithography. Roof collapse is due to the adhesion between the PDMS stamp and substrate, and it may affect the quality of soft lithography. Our analysis accounts for the interactions of multiple punches and the effect of elastic mismatch between the PDMS stamp and substrate. A scaling law among the stamp modulus, punch height and spacing, and work of adhesion between the stamp and substrate is established. Such a scaling law leads to a simple criterion against the unwanted roof collapse. The present study agrees well with the experimental data.

Original languageEnglish (US)
Pages (from-to)8058-8068
Number of pages11
JournalLangmuir
Volume21
Issue number17
DOIs
StatePublished - Aug 16 2005

Fingerprint

roofs
Roofs
Lithography
punches
lithography
Scaling laws
scaling laws
adhesion
Substrates
Adhesion
spacing
interactions

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Spectroscopy
  • Electrochemistry

Cite this

Huang, Y. Y., Zhou, W., Hsia, K. J., Menard, E., Park, J. U., Rogers, J. A., & Alleyne, A. G. (2005). Stamp collapse in soft lithography. Langmuir, 21(17), 8058-8068. https://doi.org/10.1021/la0502185
Huang, Yonggang Y. ; Zhou, Weixing ; Hsia, K. J. ; Menard, Etienne ; Park, Jang Ung ; Rogers, John A. ; Alleyne, Andrew G. / Stamp collapse in soft lithography. In: Langmuir. 2005 ; Vol. 21, No. 17. pp. 8058-8068.
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Huang, YY, Zhou, W, Hsia, KJ, Menard, E, Park, JU, Rogers, JA & Alleyne, AG 2005, 'Stamp collapse in soft lithography', Langmuir, vol. 21, no. 17, pp. 8058-8068. https://doi.org/10.1021/la0502185

Stamp collapse in soft lithography. / Huang, Yonggang Y.; Zhou, Weixing; Hsia, K. J.; Menard, Etienne; Park, Jang Ung; Rogers, John A.; Alleyne, Andrew G.

In: Langmuir, Vol. 21, No. 17, 16.08.2005, p. 8058-8068.

Research output: Contribution to journalArticle

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Huang YY, Zhou W, Hsia KJ, Menard E, Park JU, Rogers JA et al. Stamp collapse in soft lithography. Langmuir. 2005 Aug 16;21(17):8058-8068. https://doi.org/10.1021/la0502185