Steady motion of a crack parallel to a bond-plane

S. H. Chen*, L. M. Keer, J. D. Achenbach

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

9 Scopus citations


The combined effects of high crack-tip speed and the proximity of a bond-plane on the elastodynamic stress-intensity factor are investigated in this paper. The model-problem that is considered concerns the steady propagation of a crack of length 2a, parallel to a bond-plane with a half-plane of different material properties. By using a moving coordinate system and applying Fourier transform techniques and superposition methods, the mixed boundary-value problem is reduced to a dual singular integral equation with Cauchy-type kernels, which is solved numerically. Stress intensity factors and cleavage angles are computed with the material constants, crack-interface distance and the crack-tip speed as variables. It is found that the effect of the bond-plane is more intense for smaller crack-interface distance and larger crack-tip speed. The propagation speed is subsonic for both materials.

Original languageEnglish (US)
Pages (from-to)225-238
Number of pages14
JournalInternational Journal of Engineering Science
Issue number1
StatePublished - 1980

ASJC Scopus subject areas

  • Materials Science(all)
  • Engineering(all)
  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint Dive into the research topics of 'Steady motion of a crack parallel to a bond-plane'. Together they form a unique fingerprint.

Cite this