Strain gradients in Al-2% Cu thin films

Carla J Shute*, J. B. Cohen

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

34 Scopus citations


The strain gradient through the thickness of 0.5-, 1.0-, and 2.0-mm-thick Al-2% Cu films on oxidized (001) Si wafers has been examined by using glancing-angle x-ray diffraction to measure the d spacing as a function of penetration depth of the incident x-ray beam. Samples with and without a 1-μm sputtered quartz passivation layer were examined. The only gradient observed in these samples corresponded to surface relaxation in the unpassivated samples at depths of less than 50 Å. This result was verified by examining the shape of the diffraction peaks. The dislocation densities of the films were also determined from the peak shape.

Original languageEnglish (US)
Pages (from-to)2104-2110
Number of pages7
JournalJournal of Applied Physics
Issue number4
StatePublished - Dec 1 1991

ASJC Scopus subject areas

  • Physics and Astronomy(all)


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