Stress analysis of printed circuit boards with highly populated solder joints and components: A micromechanics approach

K. X. Hu, Y. Huang, C. P. Yeh, K. W. Wyatt

Research output: Contribution to journalArticle

1 Scopus citations

Abstract

The single most difficult aspect for thermo-mechanical analysis at the board level lies in to an accurate accounting for interactions among boards and small features such as solder joints and secondary components. It is the large number of small features populated in a close neighborhood that proliferates the computational intensity. This paper presents an approach to stress analysis for boards with highly populated small features (solder joints, for example). To this end, a generalized selfconsistent method, utilizing an energy balance framework and a three-phase composite model, is developed to obtain the eJJOctive properties at board level. The stress distribution inside joints and components are obtained through a back substitution. The solutions presented are mostly in the closed-form and require a minimum computational effort. The results obtained by present approach are compared with those by finite element analysis. The numerical calculations show that the proposed micromechanics approach can provide reasonably accurate solutions for highly populated printed cireuit boards.

Original languageEnglish (US)
Pages (from-to)87-93
Number of pages7
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume118
Issue number2
DOIs
StatePublished - Jan 1 1996

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

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