Stress management and reliability assessment in electronic packaging

S. Vaynman*, H. Mavoori, J. Chin, M. E. Fine, B. Moran, Leon M Keer

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

Thermomechanical problems are one of an electronic package designer's concerns. Since microelectronic packaging involves a wide variety of materials and structures subjected to diverse processing and operating conditions, complex thermal stress failure mechanisms are encountered. In electronic assemblies, stresses arise primarily from differences on coefficients in thermal expansion of the components of the assembly. This presentation gives an overview of the issues involved in stress management and assesses the effects of these stresses in the reliability of the component.

Original languageEnglish (US)
Pages (from-to)1711-1726
Number of pages16
JournalNational Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)
Volume3
StatePublished - Jan 1 1996

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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