Stresses in a multilayer thin film/substrate system subjected to nonuniform temperature

X. Feng, Yonggang Huang*, A. J. Rosakis

*Corresponding author for this work

Research output: Contribution to journalArticle

25 Citations (Scopus)

Abstract

Current methodologies used for the inference of thin film stress through curvature measurements are strictly restricted to uniform film stress and system curvature states over the entire system of a single thin film on a substrate. By considering a circular multilayer thin film/substrate system subjected to nonuniform temperature distributions, we derive relations between the stresses in each film and temperature, and between the system curvatures and temperature. These relations featured a "local" part that involves a direct dependence of the stress or curvature components on the temperature at the same point, and a "nonlocal" part, which reflects the effect of temperature of other points on the location of scrutiny. We also derive relations between the film stresses in each film and the system curvatures, which allow for the experimental inference of such stresses from full-field curvature measurements in the presence of arbitrary nonuniformities. These relations also feature a "nonlocal" dependence on curvatures making full-field measurements of curvature a necessity for the correct inference of stress. The interfacial shear tractions between the films and between the film and substrate are proportional to the gradient of the first curvature invariant, and can also be inferred experimentally.

Original languageEnglish (US)
Pages (from-to)210221-210227
Number of pages7
JournalJournal of Applied Mechanics, Transactions ASME
Volume75
Issue number2
DOIs
StatePublished - Mar 1 2008

Fingerprint

Multilayer films
curvature
Thin films
Substrates
thin films
inference
Temperature
temperature
traction
Temperature distribution
nonuniformity
temperature distribution
methodology
shear
gradients

Keywords

  • Interfacial shears
  • Multilayer thin films
  • Nonlocal stress-curvature relations
  • Nonuniform film temperatures and stresses
  • Nonuniform system curvatures

ASJC Scopus subject areas

  • Mechanics of Materials
  • Computational Mechanics

Cite this

@article{70d844ecd1524c0b84fdb0775f6e7127,
title = "Stresses in a multilayer thin film/substrate system subjected to nonuniform temperature",
abstract = "Current methodologies used for the inference of thin film stress through curvature measurements are strictly restricted to uniform film stress and system curvature states over the entire system of a single thin film on a substrate. By considering a circular multilayer thin film/substrate system subjected to nonuniform temperature distributions, we derive relations between the stresses in each film and temperature, and between the system curvatures and temperature. These relations featured a {"}local{"} part that involves a direct dependence of the stress or curvature components on the temperature at the same point, and a {"}nonlocal{"} part, which reflects the effect of temperature of other points on the location of scrutiny. We also derive relations between the film stresses in each film and the system curvatures, which allow for the experimental inference of such stresses from full-field curvature measurements in the presence of arbitrary nonuniformities. These relations also feature a {"}nonlocal{"} dependence on curvatures making full-field measurements of curvature a necessity for the correct inference of stress. The interfacial shear tractions between the films and between the film and substrate are proportional to the gradient of the first curvature invariant, and can also be inferred experimentally.",
keywords = "Interfacial shears, Multilayer thin films, Nonlocal stress-curvature relations, Nonuniform film temperatures and stresses, Nonuniform system curvatures",
author = "X. Feng and Yonggang Huang and Rosakis, {A. J.}",
year = "2008",
month = "3",
day = "1",
doi = "10.1115/1.2755178",
language = "English (US)",
volume = "75",
pages = "210221--210227",
journal = "Journal of Applied Mechanics, Transactions ASME",
issn = "0021-8936",
publisher = "American Society of Mechanical Engineers(ASME)",
number = "2",

}

Stresses in a multilayer thin film/substrate system subjected to nonuniform temperature. / Feng, X.; Huang, Yonggang; Rosakis, A. J.

In: Journal of Applied Mechanics, Transactions ASME, Vol. 75, No. 2, 01.03.2008, p. 210221-210227.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Stresses in a multilayer thin film/substrate system subjected to nonuniform temperature

AU - Feng, X.

AU - Huang, Yonggang

AU - Rosakis, A. J.

PY - 2008/3/1

Y1 - 2008/3/1

N2 - Current methodologies used for the inference of thin film stress through curvature measurements are strictly restricted to uniform film stress and system curvature states over the entire system of a single thin film on a substrate. By considering a circular multilayer thin film/substrate system subjected to nonuniform temperature distributions, we derive relations between the stresses in each film and temperature, and between the system curvatures and temperature. These relations featured a "local" part that involves a direct dependence of the stress or curvature components on the temperature at the same point, and a "nonlocal" part, which reflects the effect of temperature of other points on the location of scrutiny. We also derive relations between the film stresses in each film and the system curvatures, which allow for the experimental inference of such stresses from full-field curvature measurements in the presence of arbitrary nonuniformities. These relations also feature a "nonlocal" dependence on curvatures making full-field measurements of curvature a necessity for the correct inference of stress. The interfacial shear tractions between the films and between the film and substrate are proportional to the gradient of the first curvature invariant, and can also be inferred experimentally.

AB - Current methodologies used for the inference of thin film stress through curvature measurements are strictly restricted to uniform film stress and system curvature states over the entire system of a single thin film on a substrate. By considering a circular multilayer thin film/substrate system subjected to nonuniform temperature distributions, we derive relations between the stresses in each film and temperature, and between the system curvatures and temperature. These relations featured a "local" part that involves a direct dependence of the stress or curvature components on the temperature at the same point, and a "nonlocal" part, which reflects the effect of temperature of other points on the location of scrutiny. We also derive relations between the film stresses in each film and the system curvatures, which allow for the experimental inference of such stresses from full-field curvature measurements in the presence of arbitrary nonuniformities. These relations also feature a "nonlocal" dependence on curvatures making full-field measurements of curvature a necessity for the correct inference of stress. The interfacial shear tractions between the films and between the film and substrate are proportional to the gradient of the first curvature invariant, and can also be inferred experimentally.

KW - Interfacial shears

KW - Multilayer thin films

KW - Nonlocal stress-curvature relations

KW - Nonuniform film temperatures and stresses

KW - Nonuniform system curvatures

UR - http://www.scopus.com/inward/record.url?scp=47049111419&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=47049111419&partnerID=8YFLogxK

U2 - 10.1115/1.2755178

DO - 10.1115/1.2755178

M3 - Article

VL - 75

SP - 210221

EP - 210227

JO - Journal of Applied Mechanics, Transactions ASME

JF - Journal of Applied Mechanics, Transactions ASME

SN - 0021-8936

IS - 2

ER -