Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates

Dae Hyeong Kim*, Yun Soung Kim, Zhuangjian Liu, Jizhou Song, Hoon Sik Kim, Yonggang Y. Huang, John A. Rogers

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Electronic systems that offer elastic mechanical responses to high strain deformations are of growing interest, due to their ability to enable new electrical, optical and biomedical devices and other applications whose requirements are impossible to satisfy with conventional wafer-based technologies or even with those that offer simple bendability. This paper describes materials and mechanical design strategies for classes of electronic circuits that offer extremely high flexibility and stretchability over large area, enabling them to accommodate even demanding deformation modes, such as twisting and linear stretching to 'rubber-band' levels of strain over 100%. The use of printed single crystalline silicon nanomaterials for the semiconductor provides performance in flexible and stretchable complementary metal-oxide-semiconductor (CMOS) integrated circuits approaching that of conventional devices with comparable feature sizes formed on silicon wafers. Comprehensive theoretical studies of the mechanics reveal the way in which the structural designs enable these extreme mechanical properties without fracturing the intrinsically brittle active materials or even inducing significant changes in their electrical properties. The results, as demonstrated through electrical measurements of arrays of transistors, CMOS inverters, ring oscillators and differential amplifiers, suggest a valuable route to high performance stretchable electronics that can be integrated with nearly arbitrary substrates. We show examples ranging from plastic and rubber, to vinyl, leather and paper, with capability for large area coverage.

Original languageEnglish (US)
Title of host publicationLarge-Area Processing and Patterning for Optical, Photovoltaic and Electronic Devices - 2009
Pages43-49
Number of pages7
Volume1196
StatePublished - Oct 15 2010
Event2009 MRS Fall Meeting - Boston, MA, United States
Duration: Nov 30 2009Dec 4 2009

Other

Other2009 MRS Fall Meeting
CountryUnited States
CityBoston, MA
Period11/30/0912/4/09

Fingerprint

leather
Leather
Rubber
Silicon
rubber
Electronic equipment
plastics
CMOS integrated circuits
Plastics
Differential amplifiers
CMOS
silicon
Substrates
Formability
Silicon wafers
Structural design
electronics
Nanostructured materials
wafers
differential amplifiers

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering
  • Mechanics of Materials

Cite this

Kim, D. H., Kim, Y. S., Liu, Z., Song, J., Kim, H. S., Huang, Y. Y., & Rogers, J. A. (2010). Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates. In Large-Area Processing and Patterning for Optical, Photovoltaic and Electronic Devices - 2009 (Vol. 1196, pp. 43-49)
Kim, Dae Hyeong ; Kim, Yun Soung ; Liu, Zhuangjian ; Song, Jizhou ; Kim, Hoon Sik ; Huang, Yonggang Y. ; Rogers, John A. / Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates. Large-Area Processing and Patterning for Optical, Photovoltaic and Electronic Devices - 2009. Vol. 1196 2010. pp. 43-49
@inproceedings{4c0c3b1b02d44feca0d2310cbe0d0cdf,
title = "Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates",
abstract = "Electronic systems that offer elastic mechanical responses to high strain deformations are of growing interest, due to their ability to enable new electrical, optical and biomedical devices and other applications whose requirements are impossible to satisfy with conventional wafer-based technologies or even with those that offer simple bendability. This paper describes materials and mechanical design strategies for classes of electronic circuits that offer extremely high flexibility and stretchability over large area, enabling them to accommodate even demanding deformation modes, such as twisting and linear stretching to 'rubber-band' levels of strain over 100{\%}. The use of printed single crystalline silicon nanomaterials for the semiconductor provides performance in flexible and stretchable complementary metal-oxide-semiconductor (CMOS) integrated circuits approaching that of conventional devices with comparable feature sizes formed on silicon wafers. Comprehensive theoretical studies of the mechanics reveal the way in which the structural designs enable these extreme mechanical properties without fracturing the intrinsically brittle active materials or even inducing significant changes in their electrical properties. The results, as demonstrated through electrical measurements of arrays of transistors, CMOS inverters, ring oscillators and differential amplifiers, suggest a valuable route to high performance stretchable electronics that can be integrated with nearly arbitrary substrates. We show examples ranging from plastic and rubber, to vinyl, leather and paper, with capability for large area coverage.",
author = "Kim, {Dae Hyeong} and Kim, {Yun Soung} and Zhuangjian Liu and Jizhou Song and Kim, {Hoon Sik} and Huang, {Yonggang Y.} and Rogers, {John A.}",
year = "2010",
month = "10",
day = "15",
language = "English (US)",
isbn = "9781617387555",
volume = "1196",
pages = "43--49",
booktitle = "Large-Area Processing and Patterning for Optical, Photovoltaic and Electronic Devices - 2009",

}

Kim, DH, Kim, YS, Liu, Z, Song, J, Kim, HS, Huang, YY & Rogers, JA 2010, Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates. in Large-Area Processing and Patterning for Optical, Photovoltaic and Electronic Devices - 2009. vol. 1196, pp. 43-49, 2009 MRS Fall Meeting, Boston, MA, United States, 11/30/09.

Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates. / Kim, Dae Hyeong; Kim, Yun Soung; Liu, Zhuangjian; Song, Jizhou; Kim, Hoon Sik; Huang, Yonggang Y.; Rogers, John A.

Large-Area Processing and Patterning for Optical, Photovoltaic and Electronic Devices - 2009. Vol. 1196 2010. p. 43-49.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates

AU - Kim, Dae Hyeong

AU - Kim, Yun Soung

AU - Liu, Zhuangjian

AU - Song, Jizhou

AU - Kim, Hoon Sik

AU - Huang, Yonggang Y.

AU - Rogers, John A.

PY - 2010/10/15

Y1 - 2010/10/15

N2 - Electronic systems that offer elastic mechanical responses to high strain deformations are of growing interest, due to their ability to enable new electrical, optical and biomedical devices and other applications whose requirements are impossible to satisfy with conventional wafer-based technologies or even with those that offer simple bendability. This paper describes materials and mechanical design strategies for classes of electronic circuits that offer extremely high flexibility and stretchability over large area, enabling them to accommodate even demanding deformation modes, such as twisting and linear stretching to 'rubber-band' levels of strain over 100%. The use of printed single crystalline silicon nanomaterials for the semiconductor provides performance in flexible and stretchable complementary metal-oxide-semiconductor (CMOS) integrated circuits approaching that of conventional devices with comparable feature sizes formed on silicon wafers. Comprehensive theoretical studies of the mechanics reveal the way in which the structural designs enable these extreme mechanical properties without fracturing the intrinsically brittle active materials or even inducing significant changes in their electrical properties. The results, as demonstrated through electrical measurements of arrays of transistors, CMOS inverters, ring oscillators and differential amplifiers, suggest a valuable route to high performance stretchable electronics that can be integrated with nearly arbitrary substrates. We show examples ranging from plastic and rubber, to vinyl, leather and paper, with capability for large area coverage.

AB - Electronic systems that offer elastic mechanical responses to high strain deformations are of growing interest, due to their ability to enable new electrical, optical and biomedical devices and other applications whose requirements are impossible to satisfy with conventional wafer-based technologies or even with those that offer simple bendability. This paper describes materials and mechanical design strategies for classes of electronic circuits that offer extremely high flexibility and stretchability over large area, enabling them to accommodate even demanding deformation modes, such as twisting and linear stretching to 'rubber-band' levels of strain over 100%. The use of printed single crystalline silicon nanomaterials for the semiconductor provides performance in flexible and stretchable complementary metal-oxide-semiconductor (CMOS) integrated circuits approaching that of conventional devices with comparable feature sizes formed on silicon wafers. Comprehensive theoretical studies of the mechanics reveal the way in which the structural designs enable these extreme mechanical properties without fracturing the intrinsically brittle active materials or even inducing significant changes in their electrical properties. The results, as demonstrated through electrical measurements of arrays of transistors, CMOS inverters, ring oscillators and differential amplifiers, suggest a valuable route to high performance stretchable electronics that can be integrated with nearly arbitrary substrates. We show examples ranging from plastic and rubber, to vinyl, leather and paper, with capability for large area coverage.

UR - http://www.scopus.com/inward/record.url?scp=77957771507&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77957771507&partnerID=8YFLogxK

M3 - Conference contribution

SN - 9781617387555

VL - 1196

SP - 43

EP - 49

BT - Large-Area Processing and Patterning for Optical, Photovoltaic and Electronic Devices - 2009

ER -

Kim DH, Kim YS, Liu Z, Song J, Kim HS, Huang YY et al. Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates. In Large-Area Processing and Patterning for Optical, Photovoltaic and Electronic Devices - 2009. Vol. 1196. 2010. p. 43-49