Stretching and Breaking of Ultrathin 2D Hybrid Organic-Inorganic Perovskites

Qing Tu, Ioannis Spanopoulos, Poya Yasaei, Constantinos C. Stoumpos, Mercouri G. Kanatzidis, Gajendra S. Shekhawat*, Vinayak P. Dravid

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

52 Scopus citations


Two-dimensional (2D) hybrid organic-inorganic perovskites (HOIPs) are recent members of the 2D materials family with wide tunability, highly dynamic structural features, and excellent physical properties. Ultrathin 2D HOIPs and their heterostructures with other 2D materials have been exploited for study of physical phenomena and device applications. The in-plane mechanical properties of 2D ultrathin HOIPs are critical for understanding the coupling between mechanical and other physical fields and for integrated devices applications. Here we report the in-plane mechanical properties of ultrathin freestanding 2D lead iodide perovskite membranes and their dependence on the membrane thickness. The in-plane Young's moduli of 2D HOIPs are smaller than that of conventional covalently bonded 2D materials. As the thickness increases from monolayer to three-layer, both the Young's modulus and breaking strength decrease, while three-layer and four-layer 2D HOIPs have almost identical in-plane mechanical properties. These thickness-dependent mechanical properties can be attributed to interlayer slippage during deformation. Our results show that ultrathin 2D HOIPs exhibit outstanding breaking strength/Young's modulus ratio compared to many other widely used engineering materials and polymeric flexible substrates, which renders them suitable for application into flexible electronic devices.

Original languageEnglish (US)
Pages (from-to)10347-10354
Number of pages8
JournalACS nano
Issue number10
StatePublished - Oct 23 2018


  • 2D hybrid organic-inorganic perovskite
  • AFM indentation
  • in-plane
  • layer dependence
  • mechanical property

ASJC Scopus subject areas

  • Materials Science(all)
  • Engineering(all)
  • Physics and Astronomy(all)


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