TY - JOUR
T1 - Study of an integration platform based on an adiabatic active-layer waveguide connection for inp photonic device integration mirroring that of heterogeneous integration on silicon
AU - Chen, Changming
AU - Li, Junyu
AU - Wang, Chunxue
AU - Huang, Yingyan
AU - Zhang, Daming
AU - Shi, Zuosen
AU - Cui, Zhanchen
AU - Yi, Fei
AU - Ho, Seng Tiong
N1 - Funding Information:
Funding: This research was funded by the National Key R&D Program of China (2019YFB2203001), Science and Technology Development Plan of Jilin Province (20190302010GX), and National Natural Science Foundation of China (61675087, 61875069, 11774112 and 11604110). This work was partially supported by a NASA Early Stage Innovations grant. This work was also performed, in part, at the Center for Nanoscale Materials and a U.S. Department of Energy Office of Science user facility and was supported by the U.S. Department of Energy’s Office of Science under Contract No. DE-AC02-06CH11357.
Publisher Copyright:
© 2021 by the authors. Li-censee MDPI, Basel, Switzerland.
PY - 2021/10
Y1 - 2021/10
N2 - In this work, a photonic device integration platform capable of integration of active-pas-sive InP-based photonic devices without the use of material regrowth is introduced. The platform makes use of an adiabatic active-layer waveguide connection (ALWC) to move an optical beam between active and passive devices. The performance of this platform is analyzed using an example made up of four main sections: (1) a fiber coupling section for enabling vertical beam coupling from optical fiber into the photonic chip using a mode-matched surface grating with apodized duty cy-cles; (2) a transparent waveguide section for realizing passive photonic devices; (3) an adiabatic mode connection structure for moving the optical beam between passive and active device sections; and (4) an active device section for realizing active photonic devices. It is shown that the coupled surface grating, when added with a bottom gold reflector, can achieve a high chip-to-fiber coupling efficiency (CE) of 88.3% at 1550 nm. The adiabatic active-layer mode connection structure has an optical loss of lower than 1% (CE > 99%). The active device section can achieve an optical gain of 20 dB/mm with the use of only 3 quantum wells. The optimized structural parameters of the entire waveguide module are analyzed and discussed.
AB - In this work, a photonic device integration platform capable of integration of active-pas-sive InP-based photonic devices without the use of material regrowth is introduced. The platform makes use of an adiabatic active-layer waveguide connection (ALWC) to move an optical beam between active and passive devices. The performance of this platform is analyzed using an example made up of four main sections: (1) a fiber coupling section for enabling vertical beam coupling from optical fiber into the photonic chip using a mode-matched surface grating with apodized duty cy-cles; (2) a transparent waveguide section for realizing passive photonic devices; (3) an adiabatic mode connection structure for moving the optical beam between passive and active device sections; and (4) an active device section for realizing active photonic devices. It is shown that the coupled surface grating, when added with a bottom gold reflector, can achieve a high chip-to-fiber coupling efficiency (CE) of 88.3% at 1550 nm. The adiabatic active-layer mode connection structure has an optical loss of lower than 1% (CE > 99%). The active device section can achieve an optical gain of 20 dB/mm with the use of only 3 quantum wells. The optimized structural parameters of the entire waveguide module are analyzed and discussed.
KW - Adiabatic mode connection
KW - Fluori-nated polymer cladding
KW - InP-based photonic integration platform
KW - MQW gain waveguide
KW - Vertical coupling gratings
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U2 - 10.3390/photonics8100433
DO - 10.3390/photonics8100433
M3 - Article
AN - SCOPUS:85117292103
SN - 2304-6732
VL - 8
JO - Photonics
JF - Photonics
IS - 10
M1 - 433
ER -