Subinterfacial cracks in bimaterial systems subjected to mechanical and thermal loading

Joon Soo Bae, Sridhar Krishnaswamy*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

22 Scopus citations

Abstract

The effect of temperature on the propagation paths of subinterfacial cracks is studied. An aluminum/polymethyl-methacrylate bimaterial specimen with large mechanical and thermal mismatches is used to investigate the effect of combined thermal and mechanical loads. The stress intensity factor (SIF) generated by mechanical loading in the presence of a temperature gradient is obtained by means of experiment and analyzed using the finite element method. A full-field optical shearing interferometry technique was used to measure the crack tip stress state. The results show that thermal effects can alter the SIFs sufficiently large enough to change the fracture behavior of subinterfacial cracks.

Original languageEnglish (US)
Pages (from-to)1081-1094
Number of pages14
JournalEngineering Fracture Mechanics
Volume68
Issue number9
DOIs
StatePublished - Jun 1 2001

Keywords

  • Coherent shearing interferometer
  • Finite element method
  • Stress intensity factor
  • Subinterfacial crack
  • Thermal stress

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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