TY - JOUR
T1 - Substrate integrated waveguides optimized for ultrahigh-speed digital interconnects
AU - Simpson, Jamesina J.
AU - Taflove, Allen
AU - Mix, Jason A.
AU - Heck, Howard
N1 - Funding Information:
Manuscript received October 31, 2005; revised February 8, 2006. This work was supported by the Intel Corporation and by the National Computational Science Alliance under Grant ECS050007N. J. J. Simpson and A. Taflove are with the Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL 60208 USA (e-mail: j-simpson@northwestern.edu). J. A. Mix and H. Heck are with the Platform Technologies Laboratory, Intel Corporation, Hillsboro, OR 97124 USA. Digital Object Identifier 10.1109/TMTT.2006.873622
Funding Information:
Ms. Simpson is a member of Tau Beta Pi. She was the recipient of the National Science Foundation Graduate Research Fellowship and the Walter P. Murphy Fellowship for her graduate studies.
PY - 2006/5
Y1 - 2006/5
N2 - This paper reports an experimental and computational study of substrate integrated waveguides (SIWs) optimized for use as ultrahigh-speed bandpass waveguiding digital interconnects. The novelty of this study resides in our successful design, fabrication, and testing of low-loss SIWs that achieve 100% relative bandwidths via optimal excitation of the dominant TEio mode and avoidance of the excitation of the TE20 mode. Furthermore, our optimal structures maintain their 100% relative bandwidth while transmitting around 45° and 90° bends, and achieve measured crosstalk of better than -30 dB over the entire passband. We consider SIWs operating at center frequencies of 50 GHz, accommodating in principle data rates of greater than 50 Gb/s. These SIWs are 35% narrower in the transverse direction and provide a 20% larger relative bandwidth than our previously reported electromagnetic bandgap waveguiding digital interconnects. Since existing circuit-board technology permits dimensional reductions of the SIWs by yet another factor of 4:1 relative to the ones discussed here, bandpass operation at center frequencies approaching 200 GHz with data rates of 200 Gb/s are feasible. These data rates meet or exceed those expected eventually for proposed silicon photonic technologies.
AB - This paper reports an experimental and computational study of substrate integrated waveguides (SIWs) optimized for use as ultrahigh-speed bandpass waveguiding digital interconnects. The novelty of this study resides in our successful design, fabrication, and testing of low-loss SIWs that achieve 100% relative bandwidths via optimal excitation of the dominant TEio mode and avoidance of the excitation of the TE20 mode. Furthermore, our optimal structures maintain their 100% relative bandwidth while transmitting around 45° and 90° bends, and achieve measured crosstalk of better than -30 dB over the entire passband. We consider SIWs operating at center frequencies of 50 GHz, accommodating in principle data rates of greater than 50 Gb/s. These SIWs are 35% narrower in the transverse direction and provide a 20% larger relative bandwidth than our previously reported electromagnetic bandgap waveguiding digital interconnects. Since existing circuit-board technology permits dimensional reductions of the SIWs by yet another factor of 4:1 relative to the ones discussed here, bandpass operation at center frequencies approaching 200 GHz with data rates of 200 Gb/s are feasible. These data rates meet or exceed those expected eventually for proposed silicon photonic technologies.
KW - Finite-difference time-domain (FDTD) methods
KW - Multiprocessor interconnection
KW - Waveguide bends
KW - Waveguides
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U2 - 10.1109/TMTT.2006.873622
DO - 10.1109/TMTT.2006.873622
M3 - Article
AN - SCOPUS:33646737216
SN - 0018-9480
VL - 54
SP - 1983
EP - 1989
JO - IRE Transactions on Microwave Theory and Techniques
JF - IRE Transactions on Microwave Theory and Techniques
IS - 5
ER -