Substrate integrated waveguides optimized for ultrahigh-speed digital interconnects

Jamesina J. Simpson; Allen Taflove; Jason A. Mix; Howard Heck

doi:10.1109/TMTT.2006.873622

Substrate integrated waveguides optimized for ultrahigh-speed digital interconnects

Jamesina J. Simpson^*, Allen Taflove, Jason A. Mix, Howard Heck

^*Corresponding author for this work

Electrical and Computer Engineering

Research output: Contribution to journal › Article › peer-review

61 Scopus citations

Abstract

This paper reports an experimental and computational study of substrate integrated waveguides (SIWs) optimized for use as ultrahigh-speed bandpass waveguiding digital interconnects. The novelty of this study resides in our successful design, fabrication, and testing of low-loss SIWs that achieve 100% relative bandwidths via optimal excitation of the dominant TEio mode and avoidance of the excitation of the TE₂₀ mode. Furthermore, our optimal structures maintain their 100% relative bandwidth while transmitting around 45° and 90° bends, and achieve measured crosstalk of better than -30 dB over the entire passband. We consider SIWs operating at center frequencies of 50 GHz, accommodating in principle data rates of greater than 50 Gb/s. These SIWs are 35% narrower in the transverse direction and provide a 20% larger relative bandwidth than our previously reported electromagnetic bandgap waveguiding digital interconnects. Since existing circuit-board technology permits dimensional reductions of the SIWs by yet another factor of 4:1 relative to the ones discussed here, bandpass operation at center frequencies approaching 200 GHz with data rates of 200 Gb/s are feasible. These data rates meet or exceed those expected eventually for proposed silicon photonic technologies.

Original language	English (US)
Pages (from-to)	1983-1989
Number of pages	7
Journal	IEEE Transactions on Microwave Theory and Techniques
Volume	54
Issue number	5
DOIs	https://doi.org/10.1109/TMTT.2006.873622
State	Published - May 2006

Funding

Manuscript received October 31, 2005; revised February 8, 2006. This work was supported by the Intel Corporation and by the National Computational Science Alliance under Grant ECS050007N. J. J. Simpson and A. Taflove are with the Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL 60208 USA (e-mail: [email protected]). J. A. Mix and H. Heck are with the Platform Technologies Laboratory, Intel Corporation, Hillsboro, OR 97124 USA. Digital Object Identifier 10.1109/TMTT.2006.873622 Ms. Simpson is a member of Tau Beta Pi. She was the recipient of the National Science Foundation Graduate Research Fellowship and the Walter P. Murphy Fellowship for her graduate studies.

Keywords

Finite-difference time-domain (FDTD) methods
Multiprocessor interconnection
Waveguide bends
Waveguides

ASJC Scopus subject areas

Radiation
Condensed Matter Physics
Electrical and Electronic Engineering

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10.1109/TMTT.2006.873622

Cite this

@article{8216b34ae8ac461db83e630b0a584a22,

title = "Substrate integrated waveguides optimized for ultrahigh-speed digital interconnects",

abstract = "This paper reports an experimental and computational study of substrate integrated waveguides (SIWs) optimized for use as ultrahigh-speed bandpass waveguiding digital interconnects. The novelty of this study resides in our successful design, fabrication, and testing of low-loss SIWs that achieve 100% relative bandwidths via optimal excitation of the dominant TEio mode and avoidance of the excitation of the TE20 mode. Furthermore, our optimal structures maintain their 100% relative bandwidth while transmitting around 45° and 90° bends, and achieve measured crosstalk of better than -30 dB over the entire passband. We consider SIWs operating at center frequencies of 50 GHz, accommodating in principle data rates of greater than 50 Gb/s. These SIWs are 35% narrower in the transverse direction and provide a 20% larger relative bandwidth than our previously reported electromagnetic bandgap waveguiding digital interconnects. Since existing circuit-board technology permits dimensional reductions of the SIWs by yet another factor of 4:1 relative to the ones discussed here, bandpass operation at center frequencies approaching 200 GHz with data rates of 200 Gb/s are feasible. These data rates meet or exceed those expected eventually for proposed silicon photonic technologies.",

keywords = "Finite-difference time-domain (FDTD) methods, Multiprocessor interconnection, Waveguide bends, Waveguides",

author = "Simpson, {Jamesina J.} and Allen Taflove and Mix, {Jason A.} and Howard Heck",

note = "Funding Information: Manuscript received October 31, 2005; revised February 8, 2006. This work was supported by the Intel Corporation and by the National Computational Science Alliance under Grant ECS050007N. J. J. Simpson and A. Taflove are with the Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL 60208 USA (e-mail: [email protected]). J. A. Mix and H. Heck are with the Platform Technologies Laboratory, Intel Corporation, Hillsboro, OR 97124 USA. Digital Object Identifier 10.1109/TMTT.2006.873622 Funding Information: Ms. Simpson is a member of Tau Beta Pi. She was the recipient of the National Science Foundation Graduate Research Fellowship and the Walter P. Murphy Fellowship for her graduate studies.",

year = "2006",

month = may,

doi = "10.1109/TMTT.2006.873622",

language = "English (US)",

volume = "54",

pages = "1983--1989",

journal = "IEEE Transactions on Microwave Theory and Techniques",

issn = "0018-9480",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "5",

}

TY - JOUR

T1 - Substrate integrated waveguides optimized for ultrahigh-speed digital interconnects

AU - Simpson, Jamesina J.

AU - Taflove, Allen

AU - Mix, Jason A.

AU - Heck, Howard

N1 - Funding Information: Manuscript received October 31, 2005; revised February 8, 2006. This work was supported by the Intel Corporation and by the National Computational Science Alliance under Grant ECS050007N. J. J. Simpson and A. Taflove are with the Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL 60208 USA (e-mail: [email protected]). J. A. Mix and H. Heck are with the Platform Technologies Laboratory, Intel Corporation, Hillsboro, OR 97124 USA. Digital Object Identifier 10.1109/TMTT.2006.873622 Funding Information: Ms. Simpson is a member of Tau Beta Pi. She was the recipient of the National Science Foundation Graduate Research Fellowship and the Walter P. Murphy Fellowship for her graduate studies.

PY - 2006/5

Y1 - 2006/5

N2 - This paper reports an experimental and computational study of substrate integrated waveguides (SIWs) optimized for use as ultrahigh-speed bandpass waveguiding digital interconnects. The novelty of this study resides in our successful design, fabrication, and testing of low-loss SIWs that achieve 100% relative bandwidths via optimal excitation of the dominant TEio mode and avoidance of the excitation of the TE20 mode. Furthermore, our optimal structures maintain their 100% relative bandwidth while transmitting around 45° and 90° bends, and achieve measured crosstalk of better than -30 dB over the entire passband. We consider SIWs operating at center frequencies of 50 GHz, accommodating in principle data rates of greater than 50 Gb/s. These SIWs are 35% narrower in the transverse direction and provide a 20% larger relative bandwidth than our previously reported electromagnetic bandgap waveguiding digital interconnects. Since existing circuit-board technology permits dimensional reductions of the SIWs by yet another factor of 4:1 relative to the ones discussed here, bandpass operation at center frequencies approaching 200 GHz with data rates of 200 Gb/s are feasible. These data rates meet or exceed those expected eventually for proposed silicon photonic technologies.

AB - This paper reports an experimental and computational study of substrate integrated waveguides (SIWs) optimized for use as ultrahigh-speed bandpass waveguiding digital interconnects. The novelty of this study resides in our successful design, fabrication, and testing of low-loss SIWs that achieve 100% relative bandwidths via optimal excitation of the dominant TEio mode and avoidance of the excitation of the TE20 mode. Furthermore, our optimal structures maintain their 100% relative bandwidth while transmitting around 45° and 90° bends, and achieve measured crosstalk of better than -30 dB over the entire passband. We consider SIWs operating at center frequencies of 50 GHz, accommodating in principle data rates of greater than 50 Gb/s. These SIWs are 35% narrower in the transverse direction and provide a 20% larger relative bandwidth than our previously reported electromagnetic bandgap waveguiding digital interconnects. Since existing circuit-board technology permits dimensional reductions of the SIWs by yet another factor of 4:1 relative to the ones discussed here, bandpass operation at center frequencies approaching 200 GHz with data rates of 200 Gb/s are feasible. These data rates meet or exceed those expected eventually for proposed silicon photonic technologies.

KW - Finite-difference time-domain (FDTD) methods

KW - Multiprocessor interconnection

KW - Waveguide bends

KW - Waveguides

UR - http://www.scopus.com/inward/record.url?scp=33646737216&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33646737216&partnerID=8YFLogxK

U2 - 10.1109/TMTT.2006.873622

DO - 10.1109/TMTT.2006.873622

M3 - Article

AN - SCOPUS:33646737216

SN - 0018-9480

VL - 54

SP - 1983

EP - 1989

JO - IEEE Transactions on Microwave Theory and Techniques

JF - IEEE Transactions on Microwave Theory and Techniques

IS - 5

ER -

Substrate integrated waveguides optimized for ultrahigh-speed digital interconnects

Abstract

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Keywords

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