Subsurface imaging of integrated circuits with widefield and confocal microscopy using numerical aperture increasing lens

F. Hakan Köklü, A. N. Vamivakas, J. I. Quesnel, S. B. Ippolito, B. B. Goldberg, M. S. Ünlü

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

We report a lateral spatial resolution of 0.37μm with a custom infrared widefield microscope while imaging subsurface features in silicon integrated circuits from backside. In addition, 2.65μm apart polysilicon and metal layers can be differentiated.

Original languageEnglish (US)
Title of host publicationLEOS 2007 - IEEE Lasers and Electro-Optics Society Annual Meeting Conference Proceedings
Pages535-536
Number of pages2
DOIs
StatePublished - Dec 1 2007
Event20th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS - Lake Buena Vista, FL, United States
Duration: Oct 21 2007Oct 25 2007

Publication series

NameConference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS
ISSN (Print)1092-8081

Other

Other20th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS
CountryUnited States
CityLake Buena Vista, FL
Period10/21/0710/25/07

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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