Surface micromachined thermal shear stress sensor

Chang Liu*, Yu Chong Tai, Jin Biao Huang, Chih Ming Ho

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

51 Scopus citations

Abstract

We have designed, fabricated, and tested a new type of thermal shear-stress sensor. The sensor consists of a 2 μm wide polysilicon thermistor (with a range of lengths, 80-200 μm) on a 1.2 μm thick silicon-nitride diaphragm, which is on top of a vacuum cavity 200×200×2 μm3 in size. The vacuum cavity provides a good thermal isolation between the resistive element and the substrate; shear-stress sensitivity of 15 V/kPa at a power consumption of 12 mW (constant current = 2 mA) is obtained. The typical thermal time constant of our sensors is 350 μs, which translates into a bandwidth of 500 Hz.

Original languageEnglish (US)
Title of host publicationApplication of Microfabrication to Fluid Mechanics
PublisherASME
Pages9-15
Number of pages7
Volume197
StatePublished - Dec 1 1994
EventProceedings of the 1994 International Mechanical Engineering Congress and Exposition - Chicago, IL, USA
Duration: Nov 6 1994Nov 11 1994

Other

OtherProceedings of the 1994 International Mechanical Engineering Congress and Exposition
CityChicago, IL, USA
Period11/6/9411/11/94

ASJC Scopus subject areas

  • Engineering(all)

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