Surface micromachined thermal shear stress sensor

Chang Liu; Yu Chong Tai; Jin Biao Huang; Chih Ming Ho

Surface micromachined thermal shear stress sensor

Chang Liu^*, Yu Chong Tai, Jin Biao Huang, Chih Ming Ho

^*Corresponding author for this work

Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

58 Scopus citations

Abstract

We have designed, fabricated, and tested a new type of thermal shear-stress sensor. The sensor consists of a 2 μm wide polysilicon thermistor (with a range of lengths, 80-200 μm) on a 1.2 μm thick silicon-nitride diaphragm, which is on top of a vacuum cavity 200×200×2 μm³ in size. The vacuum cavity provides a good thermal isolation between the resistive element and the substrate; shear-stress sensitivity of 15 V/kPa at a power consumption of 12 mW (constant current = 2 mA) is obtained. The typical thermal time constant of our sensors is 350 μs, which translates into a bandwidth of 500 Hz.

Original language	English (US)
Title of host publication	Application of Microfabrication to Fluid Mechanics
Publisher	ASME
Pages	9-15
Number of pages	7
Volume	197
State	Published - Dec 1 1994
Event	Proceedings of the 1994 International Mechanical Engineering Congress and Exposition - Chicago, IL, USA Duration: Nov 6 1994 → Nov 11 1994

Other

Other	Proceedings of the 1994 International Mechanical Engineering Congress and Exposition
City	Chicago, IL, USA
Period	11/6/94 → 11/11/94

ASJC Scopus subject areas

General Engineering

Cite this

@inproceedings{dd4f805cebd84b7d99a71f33a35139df,

title = "Surface micromachined thermal shear stress sensor",

abstract = "We have designed, fabricated, and tested a new type of thermal shear-stress sensor. The sensor consists of a 2 μm wide polysilicon thermistor (with a range of lengths, 80-200 μm) on a 1.2 μm thick silicon-nitride diaphragm, which is on top of a vacuum cavity 200×200×2 μm3 in size. The vacuum cavity provides a good thermal isolation between the resistive element and the substrate; shear-stress sensitivity of 15 V/kPa at a power consumption of 12 mW (constant current = 2 mA) is obtained. The typical thermal time constant of our sensors is 350 μs, which translates into a bandwidth of 500 Hz.",

author = "Chang Liu and Tai, {Yu Chong} and Huang, {Jin Biao} and Ho, {Chih Ming}",

year = "1994",

month = dec,

day = "1",

language = "English (US)",

volume = "197",

pages = "9--15",

booktitle = "Application of Microfabrication to Fluid Mechanics",

publisher = "ASME",

note = "Proceedings of the 1994 International Mechanical Engineering Congress and Exposition ; Conference date: 06-11-1994 Through 11-11-1994",

}

TY - GEN

T1 - Surface micromachined thermal shear stress sensor

AU - Liu, Chang

AU - Tai, Yu Chong

AU - Huang, Jin Biao

AU - Ho, Chih Ming

PY - 1994/12/1

Y1 - 1994/12/1

N2 - We have designed, fabricated, and tested a new type of thermal shear-stress sensor. The sensor consists of a 2 μm wide polysilicon thermistor (with a range of lengths, 80-200 μm) on a 1.2 μm thick silicon-nitride diaphragm, which is on top of a vacuum cavity 200×200×2 μm3 in size. The vacuum cavity provides a good thermal isolation between the resistive element and the substrate; shear-stress sensitivity of 15 V/kPa at a power consumption of 12 mW (constant current = 2 mA) is obtained. The typical thermal time constant of our sensors is 350 μs, which translates into a bandwidth of 500 Hz.

AB - We have designed, fabricated, and tested a new type of thermal shear-stress sensor. The sensor consists of a 2 μm wide polysilicon thermistor (with a range of lengths, 80-200 μm) on a 1.2 μm thick silicon-nitride diaphragm, which is on top of a vacuum cavity 200×200×2 μm3 in size. The vacuum cavity provides a good thermal isolation between the resistive element and the substrate; shear-stress sensitivity of 15 V/kPa at a power consumption of 12 mW (constant current = 2 mA) is obtained. The typical thermal time constant of our sensors is 350 μs, which translates into a bandwidth of 500 Hz.

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UR - http://www.scopus.com/inward/citedby.url?scp=0028744994&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0028744994

VL - 197

SP - 9

EP - 15

BT - Application of Microfabrication to Fluid Mechanics

PB - ASME

T2 - Proceedings of the 1994 International Mechanical Engineering Congress and Exposition

Y2 - 6 November 1994 through 11 November 1994

ER -

Surface micromachined thermal shear stress sensor

Abstract

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ASJC Scopus subject areas

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