TESLA: Using microfluidics to thermally stabilize 3D stacked STT-RAM caches

Majed Valad Beigi, Gokhan Memik

Research output: Chapter in Book/Report/Conference proceedingConference contribution

12 Scopus citations

Abstract

In this work, we develop a 3D architecture that utilizes STT-RAM for the last level cache (LLC). 3D integration enables large LLCs to be stacked onto a die. However, 3D architectures suffer from higher operating temperatures due to increased power densities. The elevated temperatures can adversely impact the STT-RAM performance and reliability. The objective of this paper is to address the limits of integrating STT-RAM in 3D chip stacks from a thermal perspective and propose a novel stacking structure that minimizes heat-induced problems. Specifically, we analyze the system-level impact of increased temperatures and propose a novel technique to dynamically adjust the flow rate of the liquid interlayer cooling at run time to reduce the STT-RAM temperature and alleviate temperature-induced problems that cause the performance degradation and prevent overcooling the STT-RAM die and minimize the pump energy consumption. Evaluation results reveal that our approach achieves up to 19.1% performance improvement and 14.6% power reduction over an architecture that does not include an insulating layer.

Original languageEnglish (US)
Title of host publicationProceedings of the 34th IEEE International Conference on Computer Design, ICCD 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages344-347
Number of pages4
ISBN (Electronic)9781509051427
DOIs
StatePublished - Nov 22 2016
Event34th IEEE International Conference on Computer Design, ICCD 2016 - Scottsdale, United States
Duration: Oct 2 2016Oct 5 2016

Publication series

NameProceedings of the 34th IEEE International Conference on Computer Design, ICCD 2016

Other

Other34th IEEE International Conference on Computer Design, ICCD 2016
CountryUnited States
CityScottsdale
Period10/2/1610/5/16

Keywords

  • 3D stacking
  • Cooling Systems
  • Non-Volatile Memories
  • Temperature

ASJC Scopus subject areas

  • Hardware and Architecture

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