The Use of SPICE Lumped Circuits as Sub-grid Models for FDTD Analysis

Vincent A. Thomas; Michael E. Jones; Allen Taflove; Evans Harrigan

doi:10.1109/75.289516

The Use of SPICE Lumped Circuits as Sub-grid Models for FDTD Analysis

Vincent A. Thomas, Michael E. Jones, Allen Taflove, Evans Harrigan

Electrical and Computer Engineering

Research output: Contribution to journal › Article › peer-review

127 Scopus citations

Abstract

A general approach for including lumped circuit elements in a finite difference, time domain (FDTD) solution of Maxwell’s equations is presented. The methodology allows the direct access to SPICE to model the lumped circuits, while the full 3-Dimensional solution to Maxwell’s equations provides the crosstalk and dispersive properties of the microstrips and striplines in the circuit.

Original language	English (US)
Pages (from-to)	141-143
Number of pages	3
Journal	IEEE Microwave and Guided Wave Letters
Volume	4
Issue number	5
DOIs	https://doi.org/10.1109/75.289516
State	Published - May 1994

ASJC Scopus subject areas

General Engineering
General Physics and Astronomy

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10.1109/75.289516

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title = "The Use of SPICE Lumped Circuits as Sub-grid Models for FDTD Analysis",

abstract = "A general approach for including lumped circuit elements in a finite difference, time domain (FDTD) solution of Maxwell{\textquoteright}s equations is presented. The methodology allows the direct access to SPICE to model the lumped circuits, while the full 3-Dimensional solution to Maxwell{\textquoteright}s equations provides the crosstalk and dispersive properties of the microstrips and striplines in the circuit.",

author = "Thomas, {Vincent A.} and Jones, {Michael E.} and Allen Taflove and Evans Harrigan",

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AB - A general approach for including lumped circuit elements in a finite difference, time domain (FDTD) solution of Maxwell’s equations is presented. The methodology allows the direct access to SPICE to model the lumped circuits, while the full 3-Dimensional solution to Maxwell’s equations provides the crosstalk and dispersive properties of the microstrips and striplines in the circuit.

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The Use of SPICE Lumped Circuits as Sub-grid Models for FDTD Analysis

Abstract

ASJC Scopus subject areas

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