Theory and analysis for optimization of on-chip thermoelectric cooling systems

Jieyi Long; Dawei Li; Seda Ogrenci Memik; Semail Ulgen

doi:10.1109/TCAD.2013.2261436

Theory and analysis for optimization of on-chip thermoelectric cooling systems

Jieyi Long, Dawei Li, Seda Ogrenci Memik, Semail Ulgen

Electrical and Computer Engineering

Research output: Contribution to journal › Article › peer-review

9 Scopus citations

Abstract

We established a novel theoretical analysis framework for optimizing the cooling system configuration of chips employing thermoelectric cooling (TEC) elements by extending the theory of inverse-positive matrices and the eigenvalue/eigenvector theory in linear algebra. In this brief, we present a new theorem and its formal proof, which is the key enabler to achieving a provably optimal solution for configuring bias current levels of TEC devices.

Original language	English (US)
Article number	6601030
Pages (from-to)	1628-1632
Number of pages	5
Journal	IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Volume	32
Issue number	10
DOIs	https://doi.org/10.1109/TCAD.2013.2261436
State	Published - 2013

Keywords

Active cooling
Peltier effect
chip integration
inverse-positive matrix
thermoelectricity

ASJC Scopus subject areas

Software
Computer Graphics and Computer-Aided Design
Electrical and Electronic Engineering

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10.1109/TCAD.2013.2261436

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abstract = "We established a novel theoretical analysis framework for optimizing the cooling system configuration of chips employing thermoelectric cooling (TEC) elements by extending the theory of inverse-positive matrices and the eigenvalue/eigenvector theory in linear algebra. In this brief, we present a new theorem and its formal proof, which is the key enabler to achieving a provably optimal solution for configuring bias current levels of TEC devices.",

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AU - Long, Jieyi

AU - Li, Dawei

AU - Memik, Seda Ogrenci

AU - Ulgen, Semail

PY - 2013

Y1 - 2013

N2 - We established a novel theoretical analysis framework for optimizing the cooling system configuration of chips employing thermoelectric cooling (TEC) elements by extending the theory of inverse-positive matrices and the eigenvalue/eigenvector theory in linear algebra. In this brief, we present a new theorem and its formal proof, which is the key enabler to achieving a provably optimal solution for configuring bias current levels of TEC devices.

AB - We established a novel theoretical analysis framework for optimizing the cooling system configuration of chips employing thermoelectric cooling (TEC) elements by extending the theory of inverse-positive matrices and the eigenvalue/eigenvector theory in linear algebra. In this brief, we present a new theorem and its formal proof, which is the key enabler to achieving a provably optimal solution for configuring bias current levels of TEC devices.

KW - Active cooling

KW - Peltier effect

KW - chip integration

KW - inverse-positive matrix

KW - thermoelectricity

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Theory and analysis for optimization of on-chip thermoelectric cooling systems

Abstract

Keywords

ASJC Scopus subject areas

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