Thermal analysis of buried heterostructure quantum cascade lasers for long-wavelength infrared emission using 2D anisotropic heat-dissipation model

H. K. Lee, K. S. Chung, J. S. Yu, M. Razeghi

Research output: Contribution to journalArticlepeer-review

16 Scopus citations

Abstract

We have theoretically investigated and compared the thermal characteristics of λ ∼ 10.6 μm InGaAs/InAlAs/InP buried heterostructure (BH) quantum cascade lasers (QCLs) with different heat-sinking configurations by a steady-state heat-transfer analysis. The heat-source densities were obtained from laser threshold power densities measured experimentally under room-temperature continuous-wave mode. The two-dimensional anisotropic heat-dissipation model was used to calculate the temperature distribution, heat flux, and thermal conductance (G th) inside the device. For good thermal characteristics, the QCLs in the long-wavelength infrared region require the relatively narrow BH structure in combination with epilayer-down bonding due to thick active core/cladding layers and high insulator losses. The single-ridge BH structure results in slightly higher thermal conductance by ∼2-4% than the double-channel (DC) ridge BH structure. For W = 12 μm with 5 μm thick electroplated Au, the single-ridge BH laser with epilayer-down bonding exhibited the highest G th value of 201.9 W/K cm 2, i.e. increased by nearly 36% with respect to the epilayer-up bonded DC ridge waveguide laser. This value is improved by ∼50% and ∼62% with respect to the single-ridge BH laser and DC ridge waveguide laser with W = 20 μm in the epilayer-up bonding scheme, respectively.

Original languageEnglish (US)
Pages (from-to)356-362
Number of pages7
JournalPhysica Status Solidi (A) Applications and Materials Science
Volume206
Issue number2
DOIs
StatePublished - Feb 2009

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Materials Chemistry
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering
  • Surfaces and Interfaces

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