Abstract
Coefficients of thermal expansion in unidirectional and multidirectional laminates can be calculated using the properties of the constituents and lamination theory. Residual stresses are introduced in multidirectional laminates during curing as a result of thermal anisotropy. These stresses have been investigated analytically and experimentally. It was found that the significant strains recorded during the cooling stage of curing correspond to thermal expansion of the laminate. Residual or restraint strains are computed from measured restrained and unrestrained thermal expansions. Residual stresses are computed using appropriate orthotropic constitutive relations. Results have been obtained from a variety of materials including boron, grahite, Kevlar, S-glass and hybrids with epoxy or polyimide matrices, for a variety of lamination angles.
Original language | English (US) |
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DOIs | |
State | Published - 1980 |
Event | Therm Stresses in Sev Environ, Proc of the Int Conf on Therm Stresses in Mater and Struct in Sev Therm Environ - Blacksburg, VA, USA Duration: Mar 19 1980 → Mar 21 1980 |
Other
Other | Therm Stresses in Sev Environ, Proc of the Int Conf on Therm Stresses in Mater and Struct in Sev Therm Environ |
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City | Blacksburg, VA, USA |
Period | 3/19/80 → 3/21/80 |
ASJC Scopus subject areas
- Engineering(all)