Thermal degradation of aliphatic–aromatic polyamides: Kinetics of N,N′‐Dihexylisophthalamide neat and in presence of copper lodide

An experimental study to determine the effect of copper (I) iodide (Cul) on the rate and product distribution of degradation of a model of an aliphatic–aromatic polyamide was carried out. N,N′‐Dihexylisophthalamide (DHI) was reacted in both an inert argon atmosphere and a pure oxygen environment at 350°C with CuI added in amounts ranging from 0 to 20% by weight. The rate of disappearance of DHI was enhanced by an order of magnitude when 0.5% by weight of CuI was added and was an increasing function of increasing CuI loading. Reaction in pure O₂ increased the rate of DHI degradation by two orders of magnitude over that for neat DHI pyrolysis. The rate of disappearance of DHI in O₂ was relatively unchanged when 5% CuI by weight was added. The transformations of DHI and its products are organized in terms of a set of reaction rules. This “reaction operator” formalism allowed computer generation of the reaction network and facilitated estimation of kinetic parameters. © 1995 John Wiley & Sons, Inc.