Thermal evaluation of TiN/CNx multilayer films

Monica De Mesquita Lacerda*, Júlio Miranda Pureza, José Fernando Fragalli, Ney Mattoso Filho, Yip-Wah Chung

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

1 Scopus citations


This work examines the thermal behavior and failure mechanisms of TiN/CN x multilayer coatings deposited byDCmagnetron sputtering. The samples were examined by transmission electron microscopy before thermal analysis. During thermal analysis, the samples were heated up to 1070K at a constant rate of 10Kmin-1 in a N2 atmosphere and their thermal stability was evaluated by thermo gravimetric (TGA) and differential thermal analyses (DTA). These analyses indicate that the multilayer coating is thermally stable up to 950 K, followed by stress relaxation when the temperature exceeds 950 K. After this thermal treatment, coating surfaces were observed by scanning electron microscopy. Buckling and fractured surface were seen for multilayers deposited with and without substrate bias voltage applied during growth process, although samples deposited with substrate bias are more resistant to crack formation and propagation.

Original languageEnglish (US)
Pages (from-to)278-283
Number of pages6
JournalMaterials Chemistry and Physics
Issue number1-2
StatePublished - Dec 15 2011


  • DTA
  • Electron microscopy
  • Multilayer coating
  • Sputtering

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics

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