Thermal managerment of high power memory module for server platforms

Qi Zhu*, Xiang Li, Yinan Wu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Scopus citations

Abstract

This paper demonstrates an approach for thermal solution development of high power memory module for computer system platforms. A lumped thermal resistance equation is adopted to consider the coupling between register/buffer and DRAMs. Comprehensive thermal analysis is done to characterize the thermal resistances under various memory thermal conditions in different system configurations. Memory thermal gap is identified and addressed with efficient and low cost thermal solutions such as full DIMM heat spreader (FDHS). Structural consideration is further discussed to address FDHS air gap risk related to height differences between DRAM and register/buffer packages. The thermal solution development approach is applicable to memory modules such as registered DIMM (RDIMM) or fully buffered DIMM (FBD).

Original languageEnglish (US)
Title of host publication2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM
Pages572-576
Number of pages5
DOIs
StatePublished - Sep 9 2008
Event2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM - Orlando,FL, United States
Duration: May 28 2008May 31 2008

Other

Other2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM
CountryUnited States
CityOrlando,FL
Period5/28/085/31/08

Keywords

  • DIMM
  • DRAM
  • Heatspreader
  • Memory module
  • Thermal management

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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