Thermal sensing with lithographically patterned bimetallic thin-film thermocouples

Andrew R. Varrenti, Chuanle Zhou, A. Grace Klock, Seung H. Chyung, Jieyi Long, Seda Ogrenci Memik, M. Grayson

Research output: Contribution to journalArticlepeer-review

16 Scopus citations

Abstract

A chromiumnickel thin-film thermocouple that is 50 nm thick is demonstrated on a semiconductor substrate as proof of concept for lithographically processed bimetallic on-chip temperature sensors. The Seebeck coefficient of the thin-film thermocouple is calibrated to be 10.37 μV/°C, reproducibly smaller than the bulk literature value by a factor of 3.98. The batch reproducibility of this thin-film Seebeck coefficient is demonstrated. The linear Seebeck response up to 90 °C is calibrated with the help of a simple formula which accounts for the temperature variations of the reference thermocouple under large heat loads.

Original languageEnglish (US)
Article number5763748
Pages (from-to)818-820
Number of pages3
JournalIEEE Electron Device Letters
Volume32
Issue number6
DOIs
StatePublished - Jun 2011

Keywords

  • Seebeck coefficient
  • thermal coefficient measurements
  • thermal sensing
  • thermocouple
  • thin-film devices

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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