| Original language | English |
|---|---|
| Title of host publication | Thermal Stress and Strain in Microelectronics Packaging |
| Publisher | Van Nostrand |
| Pages | 329-359 |
| State | Published - 1993 |
Thermal Stress-Induced Open-Circuit Failure in Microelectronics Thin-Film Metallizations
Research output: Chapter in Book/Report/Conference proceeding › Chapter